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Rigid PCB | POE
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Rigid PCB

POE focuses on bare rigid PCB fabrication for prototypes and production runs since 2011. We build single- to multilayer FR-4 boards with tight impedance control, fine lines, and high reliability finishes such as ENIG, Immersion Tin, and HASL. Our UL- and ISO-certified facilities deliver fast, consistent quality for consumer, industrial, telecom, and medical applications.

From quick prototypes to volume orders, we provide engineering support, CAM optimization, and robust testing to ensure your bare boards are fabrication-ready and meet performance targets.

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WHAT CAN POE
DO FOR YOUR RIGID PCB?

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No MOQ,
24/7 engineering support

Quick-turn bare rigid PCB
prototypes in 3–5 days

1–100000 pcs
factory-direct pricing

2–40 layers rigid PCB
HDI, blind/buried vias

Impedance control, back‑drill, via plugging;
balanced/unbalanced stackups

UL, ISO9001, ISO14001,
RoHS compliant

Free CAM/DFM review
before fabrication

Fast quotation and
reply within 4 hours

One‑stop service:
fabrication, finishing, testing

99.8%+ on‑time delivery and quality satisfaction

SHOWCASE
APPLICATIONS

Send your Gerber and fabrication notes, and POE will manufacture bare rigid PCBs that meet your performance, reliability, and timeline targets. We support fine‑line routing, controlled impedance, HDI structures, and various surface finishes for consistent signal integrity and solderability across prototypes and mass production.

Consumer Electronics Rigid PCB
Consumer Electronics
Energy & Solar Rigid PCB
Energy & Solar
Agricultural Control Rigid PCB
Agriculture
Industrial Automation Rigid PCB
Industrial Automation
Medical Rigid PCB
Medical
Security Systems Rigid PCB
Security
Telecom Rigid PCB
Telecommunication
Robotics Rigid PCB
Robotics
RF & Wireless Rigid PCB
RF & Wireless
Rigid PCB application banner
Highlight image
Others:
Detail 1
Detail 2

POE RIGID PCB
CAPABILITIES

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Specifications
POE's Bare Rigid PCB Capabilities
1
PCB Layers
1 to 40 layers (FR‑4, High‑TG, Halogen‑free)
2
Order Quantity
1–100000+ pcs
3
Lead Time
Prototype 3–5 days; Production 5–15 days (contact us for exact schedule)
4
Material Options
Standard FR‑4, High‑Tg FR‑4, Low‑loss, Halogen‑free
5
Testing
100% E‑test, AOI, impedance coupon verification
6
Board Thickness
0.6 mm to 3.2 mm (custom on request)
7
Min Trace/Space
2.5 mil / 2.5 mil (down to 1.6/1.6 mil for HDI)
8
Copper Weight
0.5 oz to 3 oz (higher available upon review)
9
Surface Finish
ENIG, Immersion Tin, Immersion Silver, HASL/Lead‑free HASL, OSP
10
Via Options
Through‑hole, blind/buried, via‑in‑pad, back‑drill, via filling/plugging

RIGID PCB
MANUFACTURING PROCESS

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01
Base laminate prep
Base laminate prep
02
Photoresist coating
Photoresist coating
03
Drilling
Drilling
04
Exposure
Exposure
05
Developing
Developing
06
Copper etching
Copper etching
01
Base laminate prep
Base laminate prep
02
Photoresist coating
Photoresist coating
03
Drilling
Drilling
04
Exposure
Exposure
05
Developing
Developing
06
Copper etching
Copper etching

FAQ

Still need help? Chat with us.

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Are my design files safe when I submit them for bare rigid PCB fabrication?

Yes. We treat all Gerber/ODB++, drill, and fab notes as confidential and can sign an NDA upon request. Only authorized engineering and CAM staff access your data for manufacturing purposes.

What file formats do you accept for bare rigid PCBs?

We accept RS‑274X Gerber, ODB++, Excellon drill files, netlist, fabrication drawings, stackup, and impedance requirements. We also support exports from Altium, KiCad, Eagle, and more.

What is the typical lead time for bare rigid PCBs?

Prototypes ship in 3–5 days and standard production in 5–15 days depending on layer count, material, and finishes. Expedites are available—contact us for scheduling.

Do you provide impedance control and test coupons?

Yes. We manufacture impedance coupons per stackup and measure them to verify compliance. Controlled impedance tolerance is typically ±10% (tighter on review).

Which surface finishes are available for bare rigid PCBs?

ENIG, Immersion Tin, Immersion Silver, HASL/Lead‑free HASL, and OSP are available. We will recommend the best finish for assembly and storage needs.

PACKING & SHIPPING

Global logistics (expedited options available)

We package bare rigid PCBs with moisture barrier and ESD protection to ensure surface finish integrity and flatness in transit. Standard options include vacuum sealing, bubble wrap, and reinforced cartons. Worldwide door‑to‑door delivery is supported through trusted carriers.


01. Boards
Bare rigid PCBs inspected and labeled per lot

02. ESD bags
ESD and moisture barrier packaging for finish protection

03. Bubble wrap
Shock absorption during transportation

04. Carton boxing
Reinforced cartons with corner protection

05. Ready to ship
Tracked global delivery and customs documents support

06. Delivery confirmation
Delivery proof and post‑delivery support

PCB
ORDER PROCESS

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01

Consultation

Send Gerber/drill/fab notes to
all@poe-pcba.com

02

Quotation

Receive a detailed quote
within 24 hours

03

Order confirmation

Confirm PO and specifications

04

EQ & DFM

Engineering questions & CAM/DFM review

05

Prototype build

Start fabrication; typical 3–5 days
depending on layers

06

Production

5–15 days based on quantity & complexity

07

Logistics

Worldwide door‑to‑door shipping

08

Receiving & support

Acceptance, feedback, and after‑sales service

EXHIBITION
SHOWCASE

Meet the POE team at global electronics shows to discuss bare rigid PCB stackups, finishes, controlled impedance strategies, and quality standards. We share real build samples, coupons, and best practices to help you de‑risk fabrication and accelerate time‑to‑market.

Learn More
APEX EXPO IPC 2024
Global Sources Electronic Components Show
Hong Kong Exhibition
AMPER 2024
Electronica 2024 Germany

WHAT CUSTOMERS SAY ABOUT

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Recent Bare PCB Orders

User Name Date QTY Price

NEWS & EVENTS

Major Events
Video
Magazine
image 1

Bare Rigid PCB Quality Week

POE showcased new process controls for impedance, solder mask alignment, and back‑drill verification—helping customers achieve predictable assembly results.

2025/01/12

image 2

Stackup & Material Seminar

Engineers discussed FR‑4 variants, high‑Tg options, and how copper distribution impacts impedance and warpage in bare rigid PCBs.

2024/12/25

image 3

DFM for Bare Boards Webinar

We shared CAM tips to reduce fab holds: annular ring rules, solder mask clearance, and controlled impedance routing guidelines.

2024/11/11

Bare Rigid PCB Quality Week
New methods for impedance coupons and mask alignment reduce assembly risk and improve yield.
Stackup & Material Seminar
Choosing the right FR‑4 and copper balancing strategies for stable, flat bare rigid PCBs.
DFM for Bare Boards Webinar
DFM tips that prevent fab holds and ensure smooth production from prototype to mass build.
2024 POE Annual Conference
Highlights of process improvements and customer success stories for rigid PCB fabrication.
POE Bare Rigid PCB Manufacturing 4:30
How to place a bare rigid PCB order? 5:00
PCB production overview 3:00
Back‑drill and via options explained 3:00
Choosing the right surface finish 3:00
Quality control for bare boards 4:30
Automatic Optical Inspection (AOI) 5:00
Learn more    
2024 Oct.-Dec. POE Magazine
2024 July-Sept. POE Magazine
2024 April-June POE Magazine
2024 Jan.-Mar. POE Magazine
2023 Nov.-Dec. POE Magazine
2023 Sep.-Oct. POE Magazine
2023 Jul.-Aug. POE Magazine
Learn more     

REQUEST A FREE CONSULTATION

Tell us your bare rigid PCB requirements, stackup, finish, and quantities. Upload Gerber and fab notes—our engineers will review and quote quickly.

All POE products are backed by:

24/7 After‑Sales Support

We can sign an NDA before file transfer so you can work with confidence.

Request information