From PLC control boards to precision measurement instruments — we manufacture PCBs and PCBAs built for industrial environments. Long lifecycle, wide temperature, high reliability.
Industrial electronics span dozens of product categories. We have built boards for all of them.
A consumer product that fails gets returned. An industrial controller that fails stops a production line. A measurement instrument that drifts produces bad data. The manufacturing standard for industrial electronics is fundamentally different — and POE builds to it.
We source industrial-grade and extended-temperature components from authorized distributors. Long-lifecycle part selection, approved vendor list management, and last-time-buy support for products with 10+ year production runs.
Component selection, solder alloy, PCB material, and conformal coating are all specified for extended temperature operation. We verify thermal performance with cross-section analysis and thermal cycling on request.
Industrial products often run in small volumes with many variants. We support mixed-model production, revision changes without tooling fees, and fast turnaround for engineering changes — the same factory from prototype to production.
100% AOI, X-Ray on all BGA packages, and ICT or flying probe on every board. Full component lot traceability per assembly. IPC-A-610 Class 3 available for safety-critical and high-reliability industrial applications.
PCB Fabrication
| Parameter | Specification |
|---|---|
| Layer Count | 1 to 40 layers |
| Material | FR4, High-Tg FR4, Rogers, Aluminum, Flex PI |
| Copper Weight | 0.5 oz to 6 oz (heavy copper available) |
| Min Trace / Space | 3/3 mil standard; 2/2 mil HDI |
| Board Thickness | 0.4 mm to 6.0 mm |
| Surface Finish | HASL, ENIG, OSP, ENEPIG, Immersion Ag/Sn |
| Impedance Control | +/-5% standard; +/-3% precision |
| Prototype Lead Time | 24 hours |
PCBA Assembly
| Parameter | Specification |
|---|---|
| Assembly Type | SMT, through-hole, mixed, press-fit |
| Min Component | 0201 imperial; 01005 advanced |
| Min BGA Pitch | 0.4 mm |
| Placement Accuracy | +/-0.025 mm (Cpk ≥ 1.67) |
| Solder | Lead-free SAC305; leaded SnPb available |
| Reflow | 8-zone nitrogen atmosphere oven |
| Inspection | SPI, AOI, 2D/3D X-Ray, ICT, flying probe |
| Protection | Conformal coat, potting, underfill |
| Quality Standard | IPC-A-610 Class 2 / Class 3 |