Layers
4 to 40 layers (High-density interconnect available)
Base Material
FR-4, High-Tg FR-4, Rogers, PTFE, Polymide, Aluminum substrate, etc.
Min. Line Width
0.076mm/3mil (Ultra-fine line available upon request)
Min. Hole Size
0.15mm (mechanical), 0.1mm (laser drilling)
Min. Line Spacing
0.076mm/3mil
Copper Thickness
1oz-3oz (Inner layers), 1-13oz (Outer layers)
Board Thickness
0.2-7.0mm (±0.1mm tolerance)
Surface Finishing
HASL with lead, HASL Lead-free, Immersion Gold (ENIG), OSP, Hard Gold, Immersion Silver, Immersion Tin
Finish Copper
1-13oz (Heavy copper available for high-current applications)
Solder Mask
White, Black, Green, Blue, Red, Yellow (Custom colors available)
Testing
100% Fly probe testing (free), AOI testing, Electrical testing to IPC standards
Build Time
Standard: 5-7 days, Express: 24-48 hours (depending on complexity)
Special Capabilities
Impedance control (±10%), Blind/Buried vias, Via-in-pad, Countersink/Counterbore holes
Certification
ISO9001:2015, ISO13485:2016, ROHS, UL 94V0, IPC-600G Class II and IPC-6012B Class II standard
