Parameter | Capability |
Layer count | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 01005 or 0201 (Imperial) / 0402 or 0603 (Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Spacing | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Maximum Board Thickness | 0.062 in (1.6 mm) to 0.125 in (3.2 mm) |
Board Material | FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, etc. |
Surface Finish | HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, etc. |
Solder Paste Type | Leaded or Lead-Free |
Assembly Process | Reflow Soldering, Wave Soldering, Hand Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods | In-Circuit Test (ICT), Functional Test (FCT), Flying probe test |
Design for Manufacturing (DFM) | DFM Analysis and Feedback |
Turnaround Time | Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks |
PCB Assembly Standards | ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard |
Email: all@poe-pcba.com
FAI first article testing can detect multiple aspects of product performance and quality, including appearance, size, electrical parameters, functional performance and other aspects to ensure that the product meets requirements and standards.#pcb #pcba #FAI #testing #factory pic.twitter.com/qb0p2u4ZJk
— POE PCB/PCBA Manufacturer (@poe_pcba) November 15, 2023