POE MANUFACTURING
YOUR GLOBAL TECHNOLOGY
PARTNER
Our advanced manufacturing capabilities ensure high-quality PCBs for your most demanding applications
Explore our comprehensive PCB manufacturing capabilities across all critical parameters
| Specification | Details |
|---|---|
| Board Type | Single-sided, double-sided, multi-layer (up to 40 layers) |
| Materials | FR-4, High Tg FR-4, Rogers, Teflon, Aluminum, Polymide, etc |
| Board Dimensions | Min: 10mm x 10mm (0.4" x 0.4") Max: 500mm x 500mm (20" x 20") or larger |
| Board Thickness | 0.2mm to 6.0mm (common: 1.6mm, 0.8mm) |
| Minimum Line Width/ Spacing | 50μm/ 50μm (common:100μm/ 100μm) |
| Copper Thickness | Outer layer: 0.5oz to 10oz (17μm to 345μm) Inner layer: 0.5oz to 4oz (17μm to 140μm) |
| Surface Finishes | HASL, Lead-free HASL, ENIG, Immersion Silver, OSP, Hard Gold, Electrolytic Nickel Gold, others |
| Solder Mask Types | LPI (Liquid Photo-Imageable), dry film |
| Solder Mask Colors | Green, Blue, Red, White, Black, Matte color, etc |
| Silkscreen Colors | White, Black, Yellow, others |
| Minimum Drill Size | 0.1mm to 0.2mm (typical) |
| Drill Tolerance | +/-0.05mm (common), +/-0.025mm (advanced) |
| Aspect Ratio | Up to 10:1 or higher, subject to the service provider's specifications |
| Impedance Control | Standard tolerance: +/-10%, Advanced tolerance: +/-5% |
| Gold Finger Beveling | 30°, 45°, others upon request |
| Quality Standards | ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, ROHS, UL 94V0, IPC-600G classll, IPC-6012B classll |
| Turnaround Time | Standard: 5-10 days, Rush: 24 hours to few days depending on complexity |
| Specification | Details |
|---|---|
| Number of Layers | General PCB board: 2-40 Buried IC: yes HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias |
| Materials | FR4(shengyi): yes High Tg: Tg-220 Halongen Free: yes High Frequency: yes |
| Maximum board size | 20*35inch(508*889mm) |
| Board thickness | 0.21-6.0mm |
| Minimum track line | Portion 2mil-inner 2mil-outer |
| Minimum Spacing line | Portion 2mil-inner 2mil-outer |
| Outer layer copper thickness | 8oz |
| Inner layer copper thickness | 8oz |
| Min. finished hole size(Mechanical) | yes |
| Min. finished hole size(laser hole) | yes |
| Aspect ratio | 12:1 |
| Solder Mask Types and brand | NANYA(LP_4G): yes TAMURA(TT19G): yes TAIYO(PSR2200): yes |
| Solder Mask Color | Green, Blue, Red, White, Black, Matte color, etc |
| Impedance Control Tolerance | ±10%,50Ω and below:±5Ω: yes |
| Plug via hole | Min.size can be plugged: 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias) Max.size can be plugged: 0.7mm |
| Min. annular ring can be kept | 3mil |
| Min. SM bridge for green soldermask | 3mil |
| Min. SM bridge for black soldermask | 4mil |
| Surface Treatment | HASL: yes ENIG: yes OSP: yes LEAD FREE HASL: yes GOLD PLATING: yes IMMERSION Ag: yes IMMERSION Sn: yes |
| V-Cut | CNC V-cut, degree: 20°, 30°, 45°, 60° V-cut by hand, degree: 20°, 30°, 45°, 60° |
| Outline Profile | CNC |
| Chamfer | The angle typeof the chamfer: 20°, 30°, 45° Min. distance of jumping chamfer: 5mm |
| Tolerance of the dimension size | ±0.1mm |
| X-ray Inspection | Available |
| Tolerance of the board thickness | 0.21-1.0: ±0.1 1.0-2.5: ±7% 2.5-6.3: ±6% |
| Tolerance of the finished hole size | 0-0.3mm: ±0.08mm 0.31-0.8mm: ±0.08mm 0.81-1.60mm: ±0.05mm 1.61-2.49mm: ±0.75mm 2.5-6.0mm: +0.15/-1mm >6.0mm: +0.3/-1mm |
| Specification | Details |
|---|---|
| Base material | FR-4, High Tg, Halogen-free, PTFE, Polyimide |
| PCB type | PCB｜FPC｜R-FPC｜HDI |
| Max layer count | 40 layers |
| Min base copper thickness | 1/3 OZ (12um) |
| Max finished copper thickness | 10OZ |
| Min trace width/spacing | Inner layer: 2/2mil (H/H OZ base copper) Outer layer: 2/2mil (1/3 OZ base copper) |
| Min spacing between hole to inner layer conductor | 6mil |
| Min spacing between hole to outer layer conductor | 6mil |
| Min annular ring for via | 3mil |
| Min annular ring for component hole | 5mil |
| Min BGA diameter | 8mil |
| Min BGA pitch | 0.4mm |
| Min hole size | 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias) |
| Max aspect ratios | 20:1 |
| Min soldermask bridge width | 3mil |
| Soldermask/circuit processing method | Film｜LDI |
| Min thickness for insulating layer | 2mil |
| HDI & special type PCB | HDI(1-7 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-20 layers),Buried capacitance & resistance ...... |
| Surface Finish type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, Immersion silver, Plating hard gold, Plating silver |
| Max PCB size | 609*889mm |
We adhere to the highest quality standards to ensure your PCBs meet the most demanding requirements
ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, ROHS, UL 94V0, IPC-600G Class 2/3, IPC-6012B Class 2/3
Flying Probe Testing, AOI (Automated Optical Inspection), Impedance Testing, X-Ray Inspection, Microsection Analysis
Statistical Process Control (SPC), In-Process Quality Control (IPQC), Final Quality Control (FQC), Continuous Improvement
Discover how we've helped clients overcome complex PCB challenges with our manufacturing expertise
From bare PCB prototyping to PCBA sample production and planned bulk manufacturing transfer from Europe to China.
Advanced PCBA solutions for generalist superhumanoid robots capable of performing all core warehouse tasks.
Specialized PCB manufacturing with embedded copper coins for advanced research applications.
Upload your Gerber files for an instant quote or contact our engineering team for technical consultation
Since 1996, POE has become a globally renowned PCB company, providing small to medium volume PCB/ PCBA manufacturing services.
