China 1-40layer PCB/PCBA/EMS/OEM
One stop contract Manufacturing facility
One stop contract Manufacturing facility
+8613798543496
PCB FABRICATION CAPABILITIES
With more than 20 years of PCB manufacturing experience, POE provides complete PCB manufacturing services, from idea to manufacturing to final product shipment. Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.
We produce small/medium/large quantities of 1-40 layer printed circuit boards, including rigid PCB, flex PCB, rigid-flex, multilayer PCB, HDI PCB, aluminum PCB, double layer PCB, thick copper PCB, high frequency PCB , High TG PCB, Ceramic PCB, CEM-1 PCB.
POE PCB Manufacturing capabilities
| Board Type | Single-sided, double-sided, multi-layer (up to 40 layers) |
| Materials | FR-4, High Tg FR-4, Rogers, Teflon, Aluminum, Flex, others |
| Board Dimensions | Min: 50mm x 50mm (2" x 2") Max: 500mm x 500mm (20" x 20") or larger |
| Board Thickness | 0.2mm to 6.0mm (common: 1.6mm, 0.8mm) |
| Minimum Line Width/ Spacing | 50µm/ 50µm (common:100µm/ 100µm) |
| Copper Thickness | Outer layer: 0.5oz to 10oz (17µm to 345µm) Inner layer: 0.5oz to 4oz (17µm to 140µm) |
| Surface Finishes | HASL, Lead-free HASL, ENIG, Immersion Silver, OSP, Hard Gold, Electrolytic Nickel Gold, others |
| Solder Mask Types | LPI (Liquid Photo-Imageable), dry film |
| Solder Mask Colors | Green, White, Black, Red, Blue, Yellow, others |
| Silkscreen Colors | White, Black, Yellow, others |
| Minimum Drill Size | 0.1mm to 0.2mm (typical) |
| Drill Tolerance | +/-0.05mm (common), +/-0.025mm (advanced) |
| Aspect Ratio | Up to 10:1 or higher, subject to the service provider's specifications |
| Impedance Control | Standard tolerance: +/-10%, Advanced tolerance: +/-5% |
| Gold Finger Beveling | 30°, 45°, others upon request |
| Quality Standards | ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, ROHS, UL 94V0, IPC-600G classll, IPC-6012B classll |
| Turnaround Time | Standard: 5-10 days, Rush: 24 hours to a few days depending on complexity |
Advanced PCB Manufacturing Technical Capabilities
| Number of Layers | General PCB board: 2-64 Buried IC: yes HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias |
| Materials | FR4(shengyi): yes High Tg: Tg-220 Halongen Free: yes High Frequency: yes |
| Maximum board size | 20*35inch(508*889mm) |
| Board thickness | 0.21-6.0mm |
| Minimum track line | Portion 2mil-inner 2mil-outer |
| Minimum Spacing line | Portion 2mil-inner 2mil-outer |
| Outer layer copper thickness | 8oz |
| Inner layer copper thickness | 8oz |
| Min. finished hole size(Mechanical) | yes |
| Min. finished hole size(laser hole) | yes |
| Aspect ratio | 12:1 |
| Solder Mask Types and brand | NANYA(LP_4G): yes TAMURA(TT19G): yes TAIYO(PSR2200): yes |
| Solder Mask Color | green;blue;red;white;black: yes |
| Impedance Control Tolerance | ±10%,50Ω and below:±5Ω: yes |
| Plug via hole | Min.size can be plugged: 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias) Max.size can be plugged: 0.7mm |
| Min. annular ring can be kept | 3mil |
| Min. SM bridge for green soldermask | 3mil |
| Min. SM bridge for black soldermask | 4mil |
| Surface Treatment | HASL: yes ENIG: yes OSP: yes LEAD FREE HASL: yes GOLD PLATING: yes IMMERSION Ag: yes IMMERSION Sn: yes |
| V-Cut | CNC V-cut, degree: 20\30\45\60 V-cut by hand, degree: 20\30\45\60 |
| Outline Profile | CNC |
| Chamfer | The angle typeof the chamfer: 20\30\45 Min. distance of jumping chamfer: 5mm |
| Tolerance of the dimension size | ±0.1mm |
| Tolerance of the board thickness | 0.21-1.0: ±0.1 1.0-2.5: ±7% 2.5-6.3: ±6% |
| Tolerance of the finished hole size | 0-0.3mm: ±0.08mm 0.31-0.8mm: ±0.08mm 0.81-1.60mm: ±0.05mm 1.61-2.49mm: ±0.75mm 2.5-6.0mm: +0.15/-1mm >6.0mm: +0.3/-1mm |
| Certificates(copies are needed) | UL: yes ISO9001: yes ISO14001: yes ROHS: yes TS16949: yes |
Advanced High-quality PCB Manufacturing Capabilities
| Base material | FR-4, High Tg, Halogen-free, PTFE, Polyimide |
| PCB type | PCB｜FPC｜R-FPC｜HDI |
| Max layer count | 64 layers |
| Min base copper thickness | 1/3 OZ (12um) |
| Max finished copper thickness | 8OZ |
| Min trace width/spacing | Inner layer: 2/2mil (H/H OZ base copper) Outer layer: 2/2mil (1/3 OZ base copper) |
| Min spacing between hole to inner layer conductor | 6mil |
| Min spacing between hole to outer layer conductor | 6mil |
| Min annular ring for via | 3mil |
| Min annular ring for component hole | 5mil |
| Min BGA diameter | 8mil |
| Min BGA pitch | 0.4mm |
| Min hole size | 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias) |
| Max aspect ratios | 20:1 |
| Min soldermask bridge width | 3mil |
| Soldermask/circuit processing method | Film｜LDI |
| Min thickness for insulating layer | 2mil |
| HDI & special type PCB | HDI(1-7 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-20 layers),Buried capacitance & resistance ...... |
| Surface Finish type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, Immersion silver, Plating hard gold, Plating silver |
| Max PCB size | 609*889mm |
Email: all@poe-pcba.com
