PCB Capabilities

Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.
PCB Capabilities


With more than 20 years of PCB manufacturing experience, POE provides complete PCB manufacturing services, from idea to manufacturing to final product shipment. Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.

We produce small/medium/large quantities of 1-40 layer printed circuit boards, including rigid PCB, flex PCB, rigid-flex, multilayer PCB, HDI PCB, aluminum PCB, double layer PCB, thick copper PCB, high frequency PCB , High TG PCB, Ceramic PCB, CEM-1 PCB.

POE PCB Manufacturing capabilities

Board Type Single-sided, double-sided, multi-layer (up to 40 layers)
Materials FR-4, High Tg FR-4, Rogers, Teflon, Aluminum, Flex, others
Board Dimensions Min: 50mm x 50mm (2" x 2")
Max: 500mm x 500mm (20" x 20") or larger
Board Thickness 0.2mm to 6.0mm (common: 1.6mm, 0.8mm)
Minimum Line Width/ Spacing 50µm/ 50µm (common:100µm/ 100µm)
Copper Thickness Outer layer: 0.5oz to 10oz (17µm to 345µm)
Inner layer: 0.5oz to 4oz (17µm to 140µm)
Surface Finishes HASL, Lead-free HASL, ENIG, Immersion Silver, OSP, Hard Gold, Electrolytic Nickel Gold, others
Solder Mask Types LPI (Liquid Photo-Imageable), dry film
Solder Mask Colors Green, White, Black, Red, Blue, Yellow, others
Silkscreen Colors White, Black, Yellow, others
Minimum Drill Size 0.1mm to 0.2mm (typical)
Drill Tolerance +/-0.05mm (common), +/-0.025mm (advanced)
Aspect Ratio Up to 10:1 or higher, subject to the service provider's specifications
Impedance Control Standard tolerance: +/-10%, Advanced tolerance: +/-5%
Gold Finger Beveling 30°, 45°, others upon request
Quality Standards ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, ROHS, UL 94V0, IPC-600G classll, IPC-6012B classll
Turnaround Time Standard: 5-10 days, Rush: 24 hours to a few days depending on complexity

Advanced PCB Manufacturing Technical Capabilities

Number of Layers General PCB board: 2-64
Buried IC: yes
HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias
Materials FR4(shengyi): yes
High Tg: Tg-220
Halongen Free: yes
High Frequency: yes
Maximum board size 20*35inch(508*889mm)
Board thickness 0.21-6.0mm
Minimum track line Portion
Minimum Spacing line Portion
Outer layer copper thickness 8oz
Inner layer copper thickness 8oz
Min. finished hole size(Mechanical) yes
Min. finished hole size(laser hole) yes
Aspect ratio 12:1
Solder Mask Types and brand NANYA(LP_4G): yes
TAMURA(TT19G): yes
TAIYO(PSR2200): yes
Solder Mask Color green;blue;red;white;black: yes
Impedance Control Tolerance ±10%,50Ω and below:±5Ω: yes
Plug via hole Min.size can be plugged: 0.15mm(CNC)|0.1mm(Laser Blind/buried vias)
Max.size can be plugged: 0.7mm
Min. annular ring can be kept 3mil
Min. SM bridge for green soldermask 3mil
Min. SM bridge for black soldermask 4mil
Surface Treatment HASL: yes
ENIG: yes
OSP: yes
V-Cut CNC V-cut, degree: 20\30\45\60
V-cut by hand, degree: 20\30\45\60
Outline Profile CNC
Chamfer The angle typeof the chamfer: 20\30\45
Min. distance of jumping chamfer: 5mm
Tolerance of the dimension size ±0.1mm
Tolerance of the board thickness 0.21-1.0: ±0.1
1.0-2.5: ±7%
2.5-6.3: ±6%
Tolerance of the finished hole size 0-0.3mm: ±0.08mm
0.31-0.8mm: ±0.08mm
0.81-1.60mm: ±0.05mm
1.61-2.49mm: ±0.75mm
2.5-6.0mm: +0.15/-1mm
>6.0mm: +0.3/-1mm
Certificates(copies are needed) UL: yes
ISO9001: yes
ISO14001: yes
ROHS: yes
TS16949: yes

 Advanced High-quality PCB Manufacturing Capabilities

Base material FR-4, High Tg, Halogen-free, PTFE, Polyimide
Max layer count 64 layers
Min base copper thickness 1/3 OZ (12um)
Max finished copper thickness 8OZ
Min trace width/spacing Inner layer: 2/2mil (H/H OZ base copper)
Outer layer: 2/2mil (1/3 OZ base copper)
Min spacing between hole to inner layer conductor 6mil
Min spacing between hole to outer layer conductor 6mil
Min annular ring for via 3mil
Min annular ring for component hole 5mil
Min BGA diameter 8mil
Min BGA pitch 0.4mm
Min hole size 0.15mm(CNC)|0.1mm(Laser Blind/buried vias)
Max aspect ratios 20:1
Min soldermask bridge width 3mil
Soldermask/circuit processing method Film|LDI
Min thickness for insulating layer 2mil
HDI & special type PCB HDI(1-7 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-20 layers),Buried capacitance & resistance ......
Surface Finish type ENIG, HAL, HAL lead free, OSP, Immersion Sn, Immersion silver, Plating hard gold, Plating silver
Max PCB size 609*889mm

contact us icon

Email: all@poe-pcba.com

latest Events
POE can quickly provide you with PCB prototype/ small and medium-volume PCB/ PCBA manufacturing. Send your PCB files or BOM list to us and you will get a quote as soon as possible!
Whatsapp: 85292069596
Files (zip or rar files accepted. Max 8MB.)
Link Us on