PCB FABRICATION CAPABILITIES
With more than 20 years of PCB manufacturing experience, POE provides complete PCB manufacturing services, from idea to manufacturing to final product shipment. Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.
We produce small/medium/large quantities of 1-40 layer printed circuit boards, including rigid PCB, flex PCB, rigid-flex, multilayer PCB, HDI PCB, aluminum PCB, double layer PCB, thick copper PCB, high frequency PCB , High TG PCB, Ceramic PCB, CEM-1 PCB.
POE PCB MANUFACTURING CAPABILITIES
Products Type
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board
Solder Mask
Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black
Base Material
FR4(Shengyi China,ITEQ,KB A+,HZ), HI-TG, FR06, Rogers,Taconic,Argon,Nalco,Isola and so on
Finished Surface
Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Surface Finishing
HASL with lead, HASL Lead-free, Immersion gold, OSP, Hard Gold
Selective Surface
Treatment
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger
Technical Specification
Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 10OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm
Tolerance
Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Advanced PCB Manufacturing Technical Capability
Number of Layers
General PCB board: 2-64
Buried IC: yes
HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias
Materials
FR4(shengyi): yes
High Tg: Tg-220
EHalongen Free: yes
High Frequency: yes
Maximum board size
20*35inch(508*889mm)
Board thickness
0.21-6.0mm
Minimum track line
Portion
2mil-inner
2mil-outer
Minimum Spacing line
Portion
2mil-inner
2mil-outer
Outer layer copper
thickness
8oz
Inner layer copper
thickness
8oz
Min. finished hole size
(Mechanical)
yes
Min. finished hole size
(laser hole)
yes
Solder Mask Types
and brand
NAYA(LP_4G): yes
Tamura(TT19G): yes
TAIYO(PSR2200): yes
Solder Mask Color
green;blue;red;white;black: yes
Impedance Control
Tolerance
±10%,50Ω and below:±5Ω: yes
Plug via hole
Min.size can be plugged: 0.15mm(CNC)|0.1mm(Laser Blind/buried vias)
Max.size can be plugged: 0.7mm
Min. annular ring can
be kept
3mil
Min. SM bridge for
green soldermask
3mil
Min. SM bridge for
black soldermask
4mil
Surface Treatment
HASL: yes
ENIG: yes
OSP: yes
LEAD FREE HASL: yes
GOLD PLATING: yes
IMMERSION Ag: yes
IMMERSION Sn: yes
V-Cut
CNC V-cut, degree: 20\30\45\60
V-cut by hand, degree: 20\30\45\60
Chamfer
The angle typeof the chamfer: 20\30\45
Min. distance of jumping chamfer: 5mm
Tolerance of the
dimension size
±0.1mm
Tolerance of the board
thickness
0.21-1.0: ±0.1
1.0-2.5: ±7%
2.5-6.3: ±6%
Tolerance of the finished
hole size
0-0.3mm: ±0.08mm
0.31-0.8mm: ±0.08mm
0.81-1.60mm: ±0.05mm
1.61-2.49mm: ±0.75mm
2.5-6.0mm: +0.15/-1mm
>6.0mm: +0.3/-1mm
Certificates(copies are
needed)
UL: yes
ISO9001: yes
ISO14000: yes
ROHS: yes
TS16949: yes
Advanced High-quality PCB Manufacturing Capabilities
Base material
FR-4 | High Tg | Halogen-free | PTFE | Polyimide
PCB type
PCB|FPC|R-FPC|HDI
Max layer count
64 layers
Min base copper
thickness
1/3 OZ (12um)
Max finished copper
thickness
8OZ
Min trace width/spacing
Inner layer: 2/2mil (H/H OZ base copper)
Outer layer: 2/2mil (1/3 OZ base copper)
Min spacing between
hole to inner layer
conductor
6mil
Min spacing between
hole to outer layer
conductor
6mil
Min annular ring for via
3mil
Min annular ring for
component hole
5mil
Min hole size
0.15mm(CNC)|0.1mm(Laser Blind/buried vias)
Min soldermask bridge
width
3mil
Soldermask/circuit
processing method
Film|LDI
Min thickness for
insulating layer
2mil
HDI & special type PCB
HDI(1-7 steps)|R-FPC(2-16 layers)|High frequency mix-pressing(2-20 layers)|Buried capacitance & resistance ……
Surface Finish type
ENIG | HAL | HAL lead free | OSP | Immersion Sn | Immersion silver | Plating hard gold | Plating silver