PCB Fabrication Capabilities

PCB FABRICATION CAPABILITIES

With more than 20 years of PCB manufacturing experience, POE provides complete PCB manufacturing services, from idea to manufacturing to final product shipment. Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.

We produce small/medium/large quantities of 1-40 layer printed circuit boards, including rigid PCB, flex PCB, rigid-flex, multilayer PCB, HDI PCB, aluminum PCB, double layer PCB, thick copper PCB, high frequency PCB , High TG PCB, Ceramic PCB, CEM-1 PCB.

POE PCB MANUFACTURING CAPABILITIES

ITEM

Capability

Layers

1-40

Thicker Copper

1-10OZ

Products Type

HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board

Solder Mask

Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black

Base Material

FR4(Shengyi China,ITEQ,KB A+,HZ), HI-TG, FR06, Rogers,Taconic,Argon,Nalco,Isola and so on

Finished Surface

Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold

Surface Finishing

HASL with lead, HASL Lead-free, Immersion gold, OSP, Hard Gold

Selective Surface
Treatment

ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification

Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 10OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm

Tolerance

Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S

Advanced PCB Manufacturing Technical Capability

Number of Layers

General PCB board: 2-64
Buried IC: yes
HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias

Materials

FR4(shengyi): yes
High Tg: Tg-220
EHalongen Free: yes
High Frequency: yes

Maximum board size

20*35inch(508*889mm)

Board thickness

0.21-6.0mm

Minimum track line

Portion
2mil-inner
2mil-outer

Minimum Spacing line

Portion
2mil-inner
2mil-outer

Outer layer copper
thickness

8oz

Inner layer copper
thickness

8oz

Min. finished hole size
(Mechanical)

yes

Min. finished hole size
(laser hole)

yes

Aspect ratio

12:1

Solder Mask Types
and brand

NAYA(LP_4G): yes
Tamura(TT19G): yes
TAIYO(PSR2200): yes

Solder Mask Color

green;blue;red;white;black: yes

Impedance Control
Tolerance

±10%,50Ω and below:±5Ω: yes

Plug via hole

Min.size can be plugged: 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias)
Max.size can be plugged: 0.7mm

Min. annular ring can
be kept

3mil

Min. SM bridge for
green soldermask

3mil

Min. SM bridge for
black soldermask

4mil

Surface Treatment

HASL: yes
ENIG: yes
OSP: yes
LEAD FREE HASL: yes
GOLD PLATING: yes
IMMERSION Ag: yes
IMMERSION Sn: yes

V-Cut

CNC V-cut, degree: 20\30\45\60
V-cut by hand, degree: 20\30\45\60

Outline Profile

CNC

Chamfer

The angle typeof the chamfer: 20\30\45
Min. distance of jumping chamfer: 5mm

Tolerance of the
dimension size

±0.1mm

Tolerance of the board
thickness

0.21-1.0: ±0.1
1.0-2.5: ±7%
2.5-6.3: ±6%

Tolerance of the finished
hole size

0-0.3mm: ±0.08mm
0.31-0.8mm: ±0.08mm
0.81-1.60mm: ±0.05mm
1.61-2.49mm: ±0.75mm
2.5-6.0mm: +0.15/-1mm
>6.0mm: +0.3/-1mm

Certificates(copies are
needed)

UL: yes
ISO9001: yes
ISO14000: yes
ROHS: yes
TS16949: yes

Advanced High-quality PCB Manufacturing Capabilities

Base material

FR-4 | High Tg | Halogen-free | PTFE | Polyimide

PCB type

PCB｜FPC｜R-FPC｜HDI

Max layer count

64 layers

Min base copper
thickness

1/3 OZ (12um)

Max finished copper
thickness

8OZ

Min trace width/spacing

Inner layer: 2/2mil (H/H OZ base copper)
Outer layer: 2/2mil (1/3 OZ base copper)

Min spacing between
hole to inner layer
conductor

6mil

Min spacing between
hole to outer layer
conductor

6mil

Min annular ring for via

3mil

Min annular ring for
component hole

5mil

Min BGA diameter

8mil

Min BGA pitch

0.4mm

Min hole size

0.15mm(CNC)｜0.1mm(Laser Blind/buried vias)

Max aspect ratios

20:1

Min soldermask bridge
width

3mil

Soldermask/circuit
processing method

Film｜LDI

Min thickness for
insulating layer

2mil

HDI & special type PCB

HDI（1-7 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-20 layers）｜Buried capacitance & resistance ……

Surface Finish type

Max PCB size

609*889mm

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Get in Touch

If you have PCB/PCBA/OEM/ODM needs, please contact us, We will reply within 2 hours, and complete the quotation within 4 hours or less upon request.

Tel: +8613798543496

Email: all@poe-pcba.com

Skype:poepcba

Whatsapp: 0085292069596

Linkedin: linkedin.com/company/poe-precision-electronics-co.-ltd/