PCB Fabrication Capabilities

PCB FABRICATION CAPABILITIES

With more than 20 years of PCB manufacturing experience, POE provides complete PCB manufacturing services, from idea to manufacturing to final product shipment. Whether you have a new idea to realize, or need to manufacture an existing drawing, we can provide a complete PCB service and guarantee 100% PCB reliability.

We produce small/medium/large quantities of 1-40 layer printed circuit boards, including rigid PCB, flex PCB, rigid-flex, multilayer PCB, HDI PCB, aluminum PCB, double layer PCB, thick copper PCB, high frequency PCB , High TG PCB, Ceramic PCB, CEM-1 PCB.

POE PCB Manufacturing capabilities

Board Type	Single-sided, double-sided, multi-layer (up to 40 layers)
Materials	FR-4, High Tg FR-4, Rogers, Teflon, Aluminum, Flex, others
Board Dimensions	Min: 50mm x 50mm (2" x 2") Max: 500mm x 500mm (20" x 20") or larger
Board Thickness	0.2mm to 6.0mm (common: 1.6mm, 0.8mm)
Minimum Line Width/ Spacing	50µm/ 50µm (common:100µm/ 100µm)
Copper Thickness	Outer layer: 0.5oz to 10oz (17µm to 345µm) Inner layer: 0.5oz to 4oz (17µm to 140µm)
Surface Finishes	HASL, Lead-free HASL, ENIG, Immersion Silver, OSP, Hard Gold, Electrolytic Nickel Gold, others
Solder Mask Types	LPI (Liquid Photo-Imageable), dry film
Solder Mask Colors	Green, White, Black, Red, Blue, Yellow, others
Silkscreen Colors	White, Black, Yellow, others
Minimum Drill Size	0.1mm to 0.2mm (typical)
Drill Tolerance	+/-0.05mm (common), +/-0.025mm (advanced)
Aspect Ratio	Up to 10:1 or higher, subject to the service provider's specifications
Impedance Control	Standard tolerance: +/-10%, Advanced tolerance: +/-5%
Gold Finger Beveling	30°, 45°, others upon request
Quality Standards	ISO 9001:2015, ISO 14001:2015, ISO 13485:2016, ROHS, UL 94V0, IPC-600G classll, IPC-6012B classll
Turnaround Time	Standard: 5-10 days, Rush: 24 hours to a few days depending on complexity

Advanced PCB Manufacturing Technical Capabilities

Number of Layers	General PCB board: 2-64 Buried IC: yes HDI(buried and blind vias): HDI(7+N+7) staggered and stacked vias
Materials	FR4(shengyi): yes High Tg: Tg-220 Halongen Free: yes High Frequency: yes
Maximum board size	2035inch(508889mm)
Board thickness	0.21-6.0mm
Minimum track line	Portion 2mil-inner 2mil-outer
Minimum Spacing line	Portion 2mil-inner 2mil-outer
Outer layer copper thickness	8oz
Inner layer copper thickness	8oz
Min. finished hole size(Mechanical)	yes
Min. finished hole size(laser hole)	yes
Aspect ratio	12:1
Solder Mask Types and brand	NANYA(LP_4G): yes TAMURA(TT19G): yes TAIYO(PSR2200): yes
Solder Mask Color	green;blue;red;white;black: yes
Impedance Control Tolerance	±10%,50Ω and below:±5Ω: yes
Plug via hole	Min.size can be plugged: 0.15mm(CNC)｜0.1mm(Laser Blind/buried vias) Max.size can be plugged: 0.7mm
Min. annular ring can be kept	3mil
Min. SM bridge for green soldermask	3mil
Min. SM bridge for black soldermask	4mil
Surface Treatment	HASL: yes ENIG: yes OSP: yes LEAD FREE HASL: yes GOLD PLATING: yes IMMERSION Ag: yes IMMERSION Sn: yes
V-Cut	CNC V-cut, degree: 20\30\45\60 V-cut by hand, degree: 20\30\45\60
Outline Profile	CNC
Chamfer	The angle typeof the chamfer: 20\30\45 Min. distance of jumping chamfer: 5mm
Tolerance of the dimension size	±0.1mm
Tolerance of the board thickness	0.21-1.0: ±0.1 1.0-2.5: ±7% 2.5-6.3: ±6%
Tolerance of the finished hole size	0-0.3mm: ±0.08mm 0.31-0.8mm: ±0.08mm 0.81-1.60mm: ±0.05mm 1.61-2.49mm: ±0.75mm 2.5-6.0mm: +0.15/-1mm >6.0mm: +0.3/-1mm
Certificates(copies are needed)	UL: yes ISO9001: yes ISO14001: yes ROHS: yes TS16949: yes

Advanced High-quality PCB Manufacturing Capabilities

Base material	FR-4, High Tg, Halogen-free, PTFE, Polyimide
PCB type	PCB｜FPC｜R-FPC｜HDI
Max layer count	64 layers
Min base copper thickness	1/3 OZ (12um)
Max finished copper thickness	8OZ
Min trace width/spacing	Inner layer: 2/2mil (H/H OZ base copper) Outer layer: 2/2mil (1/3 OZ base copper)
Min spacing between hole to inner layer conductor	6mil
Min spacing between hole to outer layer conductor	6mil
Min annular ring for via	3mil
Min annular ring for component hole	5mil
Min BGA diameter	8mil
Min BGA pitch	0.4mm
Min hole size	0.15mm(CNC)｜0.1mm(Laser Blind/buried vias)
Max aspect ratios	20:1
Min soldermask bridge width	3mil
Soldermask/circuit processing method	Film｜LDI
Min thickness for insulating layer	2mil
HDI & special type PCB	HDI(1-7 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-20 layers),Buried capacitance & resistance ......
Surface Finish type	ENIG, HAL, HAL lead free, OSP, Immersion Sn, Immersion silver, Plating hard gold, Plating silver
Max PCB size	609*889mm

Email: all@poe-pcba.com

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If you have PCB/PCBA/OEM needs, please contact us, We will reply within 2 hours, and complete the quotation within 4 hours or less upon request.

Tel: +8613798543496

E-mail: all@poe-pcba.com

Skype:poepcba

Whatsapp: 85292069596

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