From server motherboards to network switch PCBAs — we manufacture the circuit boards inside data center hardware. High-layer-count, controlled impedance, high-speed signal integrity.
Every board inside a server, switch, or storage system — from the motherboard to the power management module — we manufacture it.
High-layer-count server motherboards, CPU carrier boards, GPU baseboard PCBAs, and compute module boards. Controlled impedance for PCIe 5.0, DDR5, and high-speed serial interfaces. Up to 32 layers with blind and buried vias.
Switch ASIC carrier boards, 400G/800G line card PCBAs, SmartNIC and DPU boards, optical transceiver interface modules, and out-of-band management boards. High-speed differential pair routing with tight impedance tolerance.
NVMe SSD controller boards, SAS/SATA expander PCBAs, storage backplane boards, RAID controller modules, and CXL memory expansion boards. High-density HDI construction for compact 1U/2U form factors.
Server PSU control boards, VRM (voltage regulator module) PCBAs, power distribution units, BMC (baseboard management controller) boards, and 48V bus converter control modules for open rack and OCP designs.
GPU baseboard and carrier PCBAs, FPGA accelerator card boards, AI inference module PCBAs, and PCIe add-in card boards for HPC and machine learning workloads. High-current power delivery with thermal via arrays.
Baseboard management controller PCBAs, IPMI interface boards, remote KVM modules, server sideband communication boards, and rack-level management controller PCBAs for data center infrastructure management.
A PCIe 5.0 trace routed on the wrong stackup will fail at speed. DDR5 fly-by topology requires precise length matching. 400G differential pairs need impedance held to +/-3%. These are not standard PCB requirements — they need a manufacturer who understands signal integrity.
We fabricate PCBs with impedance control to +/-5% standard and +/-3% precision. Stackup design, dielectric thickness, and copper weight are all specified and verified. TDR test coupons included on production panels.
Server and switch boards routinely require 16 to 32 layers. We fabricate HDI PCBs with laser-drilled microvias, blind vias, buried vias, and via-in-pad for the routing density that high-speed server designs demand.
GPU and CPU boards dissipate hundreds of watts. We fabricate heavy copper layers for power planes, design thermal via arrays under BGA packages, and use high-Tg materials that maintain dimensional stability at operating temperatures.
100% AOI, X-Ray inspection on all BGA packages, and ICT or flying probe testing on every board. Full component traceability and first article inspection available. IPC-A-610 Class 2 standard; Class 3 on request.
PCB Fabrication
| Parameter | Specification |
|---|---|
| Layer Count | 1 to 40 layers; HDI available |
| Material | FR4, High-Tg FR4, Rogers, Megtron 6, Isola |
| Min Trace / Space | 3/3 mil standard; 2/2 mil HDI |
| Min Hole Size | 0.1 mm laser (microvia); 0.2 mm mechanical |
| Board Thickness | 0.4 mm to 6.0 mm |
| Impedance Control | +/-5% standard; +/-3% precision |
| Via Types | Through, blind, buried, microvia, via-in-pad |
| Surface Finish | ENIG, OSP, ENEPIG, Immersion Ag/Sn |
| Prototype Lead Time | 24 hours |
PCBA Assembly
| Parameter | Specification |
|---|---|
| Assembly Type | SMT, through-hole, mixed, press-fit |
| Min Component | 01005 imperial; 0201 metric |
| Min BGA Pitch | 0.4 mm; CSP, LGA, BGA supported |
| Placement Accuracy | +/-0.025 mm (Cpk ≥ 1.67) |
| Solder | Lead-free SAC305; leaded SnPb available |
| Reflow | 8-zone nitrogen atmosphere oven |
| Inspection | SPI, AOI, 2D/3D X-Ray, ICT, flying probe |
| Quality Standard | IPC-A-610 Class 2 / Class 3 |
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
