Where Every
Board is
Built Right.

Multilayer PCB fabrication from 1 to 40 layers, supporting standard FR4, high-frequency Rogers, polyimide, and specialty substrates. From single prototype to mass production.

High Density Interconnect and rigid-flex PCB solutions for space-constrained applications. Blind and buried vias, via-in-pad, and laser drilling capabilities.

PCB prototypes from 24 hours, MOQ 1 piece. DFM review included on every order. Ideal for engineering validation before committing to production volumes.

High Density Interconnect PCB manufacturing with microvias, stacked vias, and fine-pitch traces for compact, high-performance designs.

4 to 32 layer PCB fabrication with controlled impedance, tight registration, and consistent dielectric thickness across all layers.

Controlled impedance PCBs for high-speed digital, RF, and microwave applications. Every impedance-critical board is tested and certified before shipment.

HASL, ENIG, Immersion Tin, Immersion Silver, OSP, Hard Gold, and Soft Gold. We recommend the right finish for your application and reliability requirements.

Electrical testing, AOI, X-ray inspection, and flying probe testing. Every board is verified against specification before leaving our facility.

DFM analysis and PCB layout optimization on every order. Our engineers review your files before production and flag any issues that could affect yield or reliability.

Via-in-pad and via filling technology for high-density designs. Resin-filled and copper-capped vias for BGA and fine-pitch component placement.

Heavy copper PCBs from 3.5 oz to 10 oz for power supply, automotive, and industrial applications requiring high current capacity and thermal management.