PCBA Testing

PCBA Testing
Solutions.

Comprehensive PCBA testing services to verify assembly quality, detect defects, and ensure your boards perform correctly — from solder paste inspection to functional testing.

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100%AOI Coverage

8Testing Methods

X-RayBGA & Hidden Joint Inspection

IPC-A-610Assembly Standard

Testing Services

PCBA Testing Methods

We apply the right combination of testing methods at each stage of the assembly process to catch defects early and ensure every board ships correctly.

01Visual Inspection

02ICT / BON

03SPI

04FAI

05AOI

06X-Ray

07Burn-In

08FCT

Visual

Visual Inspection

Experienced inspectors manually examine every assembled board

Detects visible soldering defects: bridges, cold joints, missing components

Low cost — suitable for small batches and simple PCBA designs

Complements automated inspection methods at every production stage

In-Circuit

In-Circuit Testing (ICT / BON)

Software-operated machine testing of populated boards

Detects shorts, opens, wrong components, and incorrect values

Tests resistance, capacitance, and other electrical parameters

High fault coverage — suitable for medium to high volume production

Pre-Reflow

Solder Paste Inspection (SPI)

Measures solder paste volume, height, and area on every pad

Detects insufficient paste, excess paste, bridging, and misalignment

Performed immediately after stencil printing, before component placement

Closed-loop feedback to the printing process for continuous improvement

First Article

First Article Inspection (FAI)

Detailed inspection of the first assembled board before production run

Verifies component placement, polarity, and soldering quality

Confirms BOM accuracy and assembly drawing compliance

Prevents systematic defects from propagating through the entire batch

Automated

Automated Optical Inspection (AOI)

High-resolution cameras scan every board automatically after reflow

Detects missing components, wrong polarity, solder bridges, and lifted leads

100% board coverage — not sampling

Applied both before and after wave soldering or reflow

X-Ray

Automated X-Ray Inspection (AXI)

X-ray imaging reveals hidden solder joints invisible to optical inspection

Essential for BGA, CSP, and chip-scale package inspection

Detects voids, bridging, missing balls, and cold joints under packages

Highest defect detection rate of all inspection methods

Reliability

Burn-In Testing

Operates boards under elevated temperature and voltage stress

Accelerates early-life failures to screen out weak units before shipment

Ensures product reliability for high-stakes applications

Duration and conditions customized to your product requirements

Functional

Functional Circuit Testing (FCT)

Simulates the board's actual operating environment and inputs

Verifies that the assembled PCBA performs its intended function

Performed at the end of the production cycle as final verification

No specialized fixture required — lower cost than ICT for some designs

Testing Process

Our PCBA Testing Process

Assessment

Initial Assessment

We review your PCBA design, IPC class requirements, and production volume to select the right combination of testing methods and develop a customized testing plan.

Pre-Assembly

SPI & First Article

Solder paste inspection before placement catches printing defects early. First article inspection on the first assembled board confirms BOM and assembly accuracy before the full run.

In-Process

AOI & Visual Inspection

100% AOI after reflow detects component placement and soldering defects. Visual inspection by experienced operators complements automated systems.

Electrical

ICT & X-Ray

In-circuit testing verifies electrical parameters. X-Ray inspection on BGA and hidden-joint assemblies ensures solder joint integrity that optical methods cannot see.

Functional

FCT & Burn-In

Functional testing confirms the board performs its intended function. Burn-in testing screens out early-life failures for high-reliability applications.

Certification

Quality Certification

Final quality review and documentation. Test reports, IPC-A-610 inspection records, and certificates of conformance provided with every shipment.

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Ensure Your
PCBA Quality.

all@poe-pcba.com

+852 9206 9596

Is X-Ray inspection standard for BGA assemblies?

Yes. All BGA, CSP, and chip-scale package assemblies receive 100% X-Ray inspection. This is the only reliable method to verify solder joint integrity under these packages.

What IPC class do you assemble and inspect to?

Standard is IPC-A-610 Class 2. Class 3 available on request for high-reliability and life-critical applications. Specify your IPC class requirement when ordering.

Do you offer functional testing?

Yes. We offer functional circuit testing (FCT) using customer-supplied test fixtures or procedures. Contact us to discuss your functional test requirements before ordering.

PCBA TestingSolutions.