Layers
4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect)
Material
FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials
Board Thickness
0.2mm - 6.0mm
Copper Thickness
0.5 oz - 6 oz (17.5μm - 210μm)
Minimum Hole Size
0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias
Minimum Trace/Space Width
2 mils (50μm) for standard HDI, down to 1 mil (25μm) for advanced designs
Solder Mask
LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors
Silkscreen
White, Black, Yellow, and other custom colors
Surface Finishes
ENIG, OSP, Immersion Silver, Immersion Tin, HASL
Blind/Buried Vias
Yes, to enable routing between adjacent or non-adjacent layers
Minimum Annular Ring
2 mils (50μm) for outer layers, 1 mil (25μm) for inner layers
Controlled Impedance
Tolerance of ±10% or better
Special Features
mbedded or integrated passive components (resistors, capacitors, etc.), rigid-flex designs, back drilling, etc.
