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Compute and Storage Networking Racks and Enclosures
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Medical Devices Consumer Healthcare Ventilator Diagnostic Electronics
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Smart LED Lighting
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Capital Electronics Robot Industrial Electronics Clean Energy Power Supply
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HDI PCB

Multi layer PCB boards are suitable for complex devices with a large number of components and circuits in complex design. Material: FR4 / FR4 TG180 / FR4 TG170 Finish treatment: Immersion Gold Copper thickness: 1oz~ 10oz Resin plugging vias & Buried vias Impedance Controller Board
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HDI PCB
HDI PCB HDI PCB HDI PCB HDI PCB
Product Description
Description
Specification
Number of layers
1-40 layers
Thicker Copper
1-10 OZ
Products Type
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board
Solder Mask
Nanya&Taiyo;LPI & Matt Red, green, yellow,white, blue,black
Base material
FR4(Shengyi China, ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic, Argon, Nalco, Isola and so on
Finished Surface
Conventional HASL
Lead-free HASL
Falsh Gold
ENIG (Immersion Gold)OSP(Entek)
Immersion Tin
ImmersionSilver
Hard Gold
Selective Surface
Treatment
ENIG(immersion Gold)+OSP
ENIG(immersion Gold)+Gold Finger
Flash Gold +Gold Finger
immersion Silver+ Gold Finger
Immersion Tin+Gold Finger
Technical Specification
Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 10OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance
Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test:
Insulating resistance: 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
HDI PCB
Multi layer PCB boards are suitable for complex devices with a large number of components and circuits in complex design.
Material: FR4 / FR4 TG180 / FR4 TG170
Finish treatment: Immersion Gold
Copper thickness: 1oz~ 10oz
Resin plugging vias & Buried vias
Impedance Controller Board
Quantity
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Email: all@poe-pcba.com
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