Layer count | 4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect) |
Base Material | FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials |
Board Thickness | 0.2mm - 6.0mm |
Copper Thickness | 0.5 oz - 6 oz (17.5μm - 210μm) |
Minimum Hole Size | 0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias |
Minimum Trace/Space Width | 2 mils (50μm) for standard HDI, down to 1 mil (25μm) for advanced designs |
Solder Mask | LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors |
Silkscreen | White, Black, Yellow, and other custom colors |
Surface Finishes | ENIG, OSP, Immersion Silver, Immersion Tin, HASL |
Blind/Buried Vias | Yes, to enable routing between adjacent or non-adjacent layers |
Minimum Annular Ring | 2 mils (50μm) for outer layers, 1 mil (25μm) for inner layers |
Controlled Impedance | Tolerance of ±10% or better |
Special Features | mbedded or integrated passive components (resistors, capacitors, etc.), rigid-flex designs, back drilling, etc. |
Email: all@poe-pcba.com
FAI first article testing can detect multiple aspects of product performance and quality, including appearance, size, electrical parameters, functional performance and other aspects to ensure that the product meets requirements and standards.#pcb #pcba #FAI #testing #factory pic.twitter.com/qb0p2u4ZJk
— POE PCB/PCBA Manufacturer (@poe_pcba) November 15, 2023