From smart home sensors to industrial monitoring nodes — we build the PCBs and PCBAs inside connected devices. Any protocol, any scale.
IoT devices span every wireless protocol and every industry. We have built boards for all of them.
IoT devices are small, battery-powered, and deployed in millions. The manufacturing tolerances, component choices, and testing methods that work for a desktop product will not work here.
We place components down to 01005 and 0.4 mm BGA pitch. HDI PCBs with laser-drilled microvias, buried vias, and stacked vias for the densest IoT module designs.
Component placement, copper pour, and solder joint quality all affect leakage current. We work with your design team on layout review and select ultra-low-power components to hit your battery life targets.
Wireless performance depends on PCB stackup, ground plane design, and antenna clearance. We review RF layouts before fabrication and can recommend stackup changes that improve range and reduce interference.
IoT products often start as a single prototype and scale to high volume fast. We support the full journey — same factory, same quality system, same contact person from prototype to mass production.
PCB Fabrication
| Parameter | Specification |
|---|---|
| Layer Count | 1 to 40 layers; HDI available |
| Material | FR4, High-Tg, Rogers, Flex PI, Rigid-Flex |
| Min Trace / Space | 3/3 mil standard; 2/2 mil HDI |
| Min Hole Size | 0.1 mm laser (microvia); 0.2 mm mechanical |
| Board Thickness | 0.4 mm to 6.0 mm |
| Surface Finish | ENIG, OSP, ENEPIG, Immersion Ag/Sn |
| Impedance Control | +/-5% standard; +/-3% precision |
| Prototype Lead Time | 24 hours |
PCBA Assembly
| Parameter | Specification |
|---|---|
| Assembly Type | SMT, through-hole, mixed, press-fit |
| Min Component | 01005 imperial; 0201 metric |
| Min BGA Pitch | 0.4 mm; CSP and LGA supported |
| Placement Accuracy | +/-0.025 mm (Cpk ≥ 1.67) |
| Solder | Lead-free SAC305; leaded SnPb available |
| Reflow | 8-zone nitrogen atmosphere oven |
| Inspection | SPI, AOI, 2D/3D X-Ray, ICT, flying probe |
| Quality Standard | IPC-A-610 Class 2 / Class 3 |
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
