From soil sensors to drone flight controllers — we build the circuit boards. Prototype or production, POE handles both.
If your product runs in a field, greenhouse, or on a drone — we have built boards like yours before.
Multi-layer PCBs for GPS guidance units, variable rate application controllers, and yield mapping systems. High-reliability, field-hardened assemblies.
PCBA for automated irrigation systems — valve driver boards, flow sensor interfaces, wireless communication modules, and solar-powered field units.
High-density PCBAs for UAV flight controllers, spray system boards, motor driver modules, and autonomous ground robot control units.
PCBAs for greenhouse climate controllers, LED grow light drivers, CO2 and humidity sensor interfaces, and multi-zone automation systems.
Low-power PCBAs for soil moisture, pH, and nutrient sensors. LoRa, NB-IoT, and Zigbee communication boards for field-deployed monitoring networks.
RFID reader PCBs, animal health monitoring boards, wireless telemetry modules, and wearable sensor assemblies for livestock management systems.
A board that works in a lab can fail in a field. Dust, moisture, temperature swings, and vibration destroy ordinary assemblies. POE builds for the conditions your product actually operates in.
We apply acrylic, silicone, and polyurethane conformal coatings, and offer full potting for boards that must meet IP67 or higher. Tested to IEC 60068 environmental standards.
Component selection, solder alloy, and PCB material are all chosen for extended temperature range. We source industrial-grade and automotive-grade parts where standard commercial parts would fail.
Field-deployed sensors run on batteries or solar for months. We work with your design team on component placement, power plane layout, and assembly techniques that minimize leakage and maximize battery life.
All assemblies are built and inspected to IPC-A-610. Class 3 available for safety-critical agricultural systems. Full AOI, X-Ray, and ICT inspection on every production run.
PCB Fabrication
| Parameter | Specification |
|---|---|
| Layer Count | 1 to 40 layers |
| Material | FR4, High-Tg, Rogers, Aluminum, Flex PI |
| Min Trace / Space | 3/3 mil standard; 2/2 mil HDI |
| Min Hole Size | 0.2 mm laser; 0.3 mm mechanical |
| Board Thickness | 0.4 mm to 6.0 mm |
| Surface Finish | HASL, ENIG, OSP, ENEPIG, Immersion Ag/Sn |
| Copper Weight | 0.5 oz to 6 oz |
| Impedance Control | +/-5% standard; +/-3% precision |
| Prototype Lead Time | 24 hours |
PCBA Assembly
| Parameter | Specification |
|---|---|
| Assembly Type | SMT, through-hole, mixed, press-fit |
| Min Component | 0201 imperial; 01005 advanced |
| Min BGA Pitch | 0.4 mm |
| Placement Accuracy | +/-0.025 mm (Cpk ≥ 1.67) |
| Solder | Lead-free SAC305; leaded SnPb available |
| Reflow | 8-zone nitrogen atmosphere oven |
| Inspection | SPI, AOI, 2D/3D X-Ray, ICT, flying probe |
| Protection | Conformal coat, potting, underfill |
| Quality Standard | IPC-A-610 Class 2 / Class 3 |
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
