Layers
1-40+ layers (High-density multilayer capability)
Assembly Type
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT), Advanced Package-on-Package
Minimum Component Size
01005 or 0201 (Imperial) / 0402 or 0603 (Metric) - Industry-leading miniaturization
Maximum Component Size
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, CSP, PoP, and specialized IoT modules
Minimum Pad Pitch
0.4 mm (16 mil) for QFP/QFN, 0.5 mm (20 mil) for BGA - Suitable for high-density IoT designs
Minimum Trace Width
0.10 mm (4 mil) - Precision manufacturing for complex routing
Minimum Trace Spacing
0.10 mm (4 mil) - Enabling high-density interconnects
Minimum Drill Size
0.15 mm (6 mil) - Precision micro-vias available
Maximum Board Size
18 in x 24 in (457 mm x 610 mm) - Accommodating large-scale IoT infrastructure
Maximum Board Thickness
0.062 in (1.6 mm) to 0.125 in (3.2 mm) - Custom thicknesses available upon request
Board Material
FR-4, High-Tg FR-4, Aluminum, High Frequency (RF), Flexible(FPC), Rigid-Flex, Rogers, Polyimide - Optimized for IoT applications
Surface Finish
HASL, ENIG (Immersion Gold), Gold Finger, OSP, Immersion Silver, Immersion Tin - Application-specific finishes
Impedance Control
±10% standard, ±5% available for high-speed designs
Solder Paste Type
Leaded or Lead-Free (RoHS compliant) - Temperature-optimized for sensitive components
Assembly Process
Advanced Reflow Soldering, Selective Wave Soldering, Precision Hand Soldering, Nitrogen environment available
Inspection Methods
Automated Optical Inspection (AOI), X-ray (AXI), 3D Solder Paste Inspection (SPI), Visual Inspection
Testing Methods
In-Circuit Test (ICT), Functional Test (FCT), Flying probe test, Boundary Scan (JTAG), IoT-specific protocol testing
Design for Manufacturing (DFM)
Comprehensive DFM Analysis and Expert Feedback, Design Optimization for IoT applications
Turnaround Time
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks - Expedited services available
Wireless Module Assembly
WiFi, Bluetooth, LoRa, Zigbee, NB-IoT, LTE-M, 5G modules with testing capabilities
Certifications & Standards
ISO9001:2015, ISO13485:2016, ROHS, REACH, UL 94V0, IPC-A-600G Class II/III, IPC-6012B Class II/III, IPC-A-610 Class II/III
