HDI PCB Manufacturing

High Density
Interconnect PCB.

Advanced HDI PCB fabrication with microvias, sequential lamination, and ultra-fine pitch capabilities. 1+N+1 to 3+N+3 structures for smartphones, wearables, and high-performance computing.

Laser-drilled microvias down to 50μm diameter with copper filling

Sequential lamination: 1+N+1 to 3+N+3 with stacked & staggered microvias

Ultra-fine trace/space down to 25μm/25μm

Cross-section analysis, microvia inspection, 100% electrical testing

IPC-A-600 and IPC-A-610 compliant

Get Free DFM & Quote in 24h

ISO 9001 UL Recognized RoHS & REACH IPC-A-600 / 610 NDA Protected Export to 30+ Countries

50μmMin Microvia Diameter

3+N+3Max HDI Structure

25μmMin Trace / Space

5–7 DaysHDI Prototype

4–20LLayer Count

Technical Capabilities

HDI PCB Specifications

Parameter	POE HDI PCB Capability
PCB Layers	4 to 20 layers HDI (1+N+1 to 3+N+3 structures)
Order Quantity	1 to 100,000+ pcs; no minimum order
Lead Time	Prototype 5–7 days; Production 7–18 days (depends on HDI complexity)
Material Options	Low-loss dielectrics, Modified Epoxy, Polyimide, Low-Dk/Df materials
Board Thickness	0.4 mm to 2.0 mm (ultra-thin HDI capability)
Min Trace / Space	1.6 mil / 1.6 mil standard; down to 25μm / 25μm for advanced HDI
Copper Weight	0.5 oz to 3 oz (higher available upon review)
Via Options	Laser microvias (50μm–150μm), stacked / staggered vias, via-in-pad, copper-filled microvias
Surface Finish	ENIG, Immersion Tin, Immersion Silver, HASL / Lead-free HASL, OSP
Testing	100% E-test, AOI, microvia inspection, impedance verification, cross-section analysis
Certifications	UL, ISO 9001, ISO 14001, RoHS, REACH, IPC-A-600, IPC-A-610

Why POE

A Manufacturing Partner

From first DFM review to DDP delivery in the US and EU — we remove the friction of sourcing HDI PCBs overseas.

Free DFM & Engineering Support

Every HDI order includes a free CAM/DFM review by our engineering team before fabrication.

Stackup, microvia aspect ratio and impedance review
Quote and DFM feedback within 24 hours
Direct engineer communication, no ticket queue

Fast Turnaround & Reliable Capacity

Dedicated HDI lines with sequential lamination capacity, built for both prototype and volume.

HDI prototype in 5–7 days, production in 7–18 days
1 to 100,000+ pcs, no minimum order
DDP / FOB / EXW shipping options for US & EU

Quality, Compliance & Confidentiality

Certified processes and IP protection that meet the audit requirements of Western OEMs.

ISO 9001, UL, RoHS, REACH, IPC-A-600 / 610
NDA signed on request, files stored under access control
100% E-test, microvia inspection, cross-section analysis

Applications

Where HDI PCBs Are Used

HDI technology enables the miniaturization and performance density required by today's most demanding electronic products.

Smartphones & Tablets

Wearable Devices

High-Speed Computing

5G Infrastructure

Medical Implants

IoT Sensors

Automotive Electronics

AI Processors

Millimeter Wave

Case Studies

Recent HDI Builds

A snapshot of HDI projects shipped to customers in the US, EU and Asia. Full details available under NDA on request.

5G / RF — Europe

5G mmWave Antenna Module

Structure10L 3+N+3 HDI

Microvia50μm laser-drilled

MaterialRogers RO4003C + FR4 hybrid

Surface FinishENIG

Lead Time12 days

Medical — United States

Wearable Medical Sensor Board

Structure6L 2+N+2 HDI

Board Thickness0.6 mm ultra-thin

MaterialPolyimide

Surface FinishENIG

Lead Time7 days

AI / HPC — Germany

AI Accelerator Card

Structure16L 3+N+3 HDI

Trace / Space30 / 30 μm

MaterialPanasonic M6 low-loss

Surface FinishImmersion Silver

Lead Time18 days

Manufacturing Process

HDI PCB Manufacturing Process

Core Substrate Preparation

Laser Microvia Drilling

Desmear & Metallization

Build-Up Layer Lamination

Sequential Processing

Final Surface Finish & Testing

FAQ

Common Questions

Still have questions? Contact us directly — we respond within 4 business hours.

Get Free DFM & Quote

What HDI structures can POE manufacture?+

We manufacture 1+N+1 to 3+N+3 HDI structures with laser-drilled microvias, stacked and staggered configurations, skip vias, and any-layer HDI designs. Our advanced sequential build-up process supports complex multilayer HDI requirements.

What is the minimum microvia size you can achieve?+

Our laser drilling systems can produce microvias as small as 50μm diameter with precise aspect ratios. We support copper-filled microvias, via-in-pad designs, and maintain tight tolerances for high-density interconnect applications.

What is the typical lead time for HDI PCBs?+

HDI prototypes require 5–7 days due to sequential lamination processes, while production runs take 7–18 days depending on HDI complexity and layer count. Complex 3+N+3 structures may require additional time.

How do you ensure HDI quality and reliability?+

We perform comprehensive testing including cross-section analysis, microvia inspection, impedance verification, and 100% electrical testing. Our sequential build-up process includes quality checkpoints at each lamination cycle.

Do you offer free DFM review for HDI designs?+

Yes. We provide free CAM/DFM review before fabrication for all HDI orders. Our engineers check stackup design, microvia aspect ratios, pad sizes, and trace/space rules to prevent manufacturing issues before production begins.

What materials are available for HDI PCBs?+

We support low-loss dielectrics, modified epoxy, polyimide, and low-Dk/Df materials for high-frequency HDI applications. Material selection depends on your frequency requirements, thermal performance needs, and cost targets.

Will you sign an NDA to protect my design?+

Yes. We regularly sign customer NDAs before receiving Gerber files. Your designs, stackups and BOMs are stored in access-controlled systems and are never shared with third parties. If you need a mutual NDA, send us yours or we can provide our template.

What payment terms do you accept?+

For prototype and small production orders, we accept T/T bank transfer and major credit cards. For larger production accounts we offer net-30 terms after credit approval. Currency can be USD, EUR or RMB — whichever is easier for your accounting.

Do you ship DDP to the US and EU?+

Yes. We offer DDP, DAP, FOB and EXW shipping terms. DDP is available for the United States, most EU countries and the UK, which means we handle export clearance, freight, import duties and delivery to your door — you do not need a customs broker.

Can I order a small sample before production?+

Absolutely. We have no minimum order quantity. You can start with 1–10 pcs to validate the design, then scale to 1,000+ pcs with the same stackup and process, so your qualification carries over to production.

What happens if a board fails inspection or your quality standard?+

Every shipment includes 100% electrical test data. If any board fails to meet the agreed IPC class or our own inspection standard, we will rework or remake it at our cost. For production orders we also offer outgoing quality reports and, on request, third-party inspection support.

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