HDI PCB

We offer advanced HDI (High Density Interconnect) PCB design and manufacturing services, combining cutting-edge laser drilling technology with sequential build-up processes to deliver ultra-high density interconnect solutions for your miniaturized designs:

Precision laser-drilled microvias down to 50μm diameter with perfect aspect ratios and copper filling;
Sequential lamination capability supporting 1+N+1 to 3+N+3 HDI structures with stacked and staggered microvia configurations;
Ultra-fine trace/space down to 25μm/25μm enabling maximum routing density in compact form factors;
Comprehensive quality control with cross-section analysis, microvia inspection, and 100% electrical testing ensuring signal integrity;
Full compliance with IPC-A-600 and IPC-A-610 standards, guaranteeing reliability and performance for next-generation electronic devices.

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HDI PCB Manufacturing

High Density
Interconnect PCB.

Advanced HDI PCB fabrication with microvias, sequential lamination, and ultra-fine pitch capabilities. 1+N+1 to 3+N+3 structures for smartphones, wearables, and high-performance computing.

Laser-drilled microvias down to 50μm diameter with copper filling

Sequential lamination: 1+N+1 to 3+N+3 with stacked & staggered microvias

Ultra-fine trace/space down to 25μm/25μm

Cross-section analysis, microvia inspection, 100% electrical testing

IPC-A-600 and IPC-A-610 compliant

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50μmMin Microvia Diameter

3+N+3Max HDI Structure

25μmMin Trace / Space

5–7 DaysHDI Prototype

4–20LLayer Count

Applications

Where HDI PCBs Are Used

HDI technology enables the miniaturization and performance density required by today's most demanding electronic products.

Smartphones & Tablets

Wearable Devices

High-Speed Computing

5G Infrastructure

Medical Implants

IoT Sensors

Automotive Electronics

AI Processors

Millimeter Wave

Technical Capabilities

HDI PCB Specifications

Parameter	POE HDI PCB Capability
PCB Layers	4 to 20 layers HDI (1+N+1 to 3+N+3 structures)
Order Quantity	1 to 100,000+ pcs; no minimum order
Lead Time	Prototype 5–7 days; Production 7–18 days (depends on HDI complexity)
Material Options	Low-loss dielectrics, Modified Epoxy, Polyimide, Low-Dk/Df materials
Board Thickness	0.4 mm to 2.0 mm (ultra-thin HDI capability)
Min Trace / Space	1.6 mil / 1.6 mil standard; down to 25μm / 25μm for advanced HDI
Copper Weight	0.5 oz to 3 oz (higher available upon review)
Via Options	Laser microvias (50μm–150μm), stacked / staggered vias, via-in-pad, copper-filled microvias
Surface Finish	ENIG, Immersion Tin, Immersion Silver, HASL / Lead-free HASL, OSP
Testing	100% E-test, AOI, microvia inspection, impedance verification, cross-section analysis
Certifications	UL, ISO 9001, ISO 14001, RoHS, IPC-A-600, IPC-A-610

Manufacturing Process

HDI PCB Manufacturing Process

Core Substrate Preparation

Laser Microvia Drilling

Desmear & Metallization

Build-Up Layer Lamination

Sequential Processing

Final Surface Finish & Testing

FAQ

Common Questions

Still have questions? Contact us directly — we respond within 4 hours.

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What HDI structures can POE manufacture?+

We manufacture 1+N+1 to 3+N+3 HDI structures with laser-drilled microvias, stacked and staggered configurations, skip vias, and any-layer HDI designs. Our advanced sequential build-up process supports complex multilayer HDI requirements.

What is the minimum microvia size you can achieve?+

Our laser drilling systems can produce microvias as small as 50μm diameter with precise aspect ratios. We support copper-filled microvias, via-in-pad designs, and maintain tight tolerances for high-density interconnect applications.

What is the typical lead time for HDI PCBs?+

HDI prototypes require 5–7 days due to sequential lamination processes, while production runs take 7–18 days depending on HDI complexity and layer count. Complex 3+N+3 structures may require additional time.

How do you ensure HDI quality and reliability?+

We perform comprehensive testing including cross-section analysis, microvia inspection, impedance verification, and 100% electrical testing. Our sequential build-up process includes quality checkpoints at each lamination cycle.

Do you offer free DFM review for HDI designs?+

Yes. We provide free CAM/DFM review before fabrication for all HDI orders. Our engineers check stackup design, microvia aspect ratios, pad sizes, and trace/space rules to prevent manufacturing issues before production begins.

What materials are available for HDI PCBs?+

We support low-loss dielectrics, modified epoxy, polyimide, and low-Dk/Df materials for high-frequency HDI applications. Material selection depends on your frequency requirements, thermal performance needs, and cost targets.

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Start Your
HDI PCB Project.

all@poe-pcba.com

+852 9206 9596

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About Us

SNS

Auto PCBA ≠ a “standard industrial build.”
It needs: stable power soldering, tight control across SMT+DIP+THT, clear traceability, and batch-to-batch consistency.
POE runs these in one aligned workflow—so execution risk is addressed early.
DM Gerber+BOM+qty+application. pic.twitter.com/pByo7ZD7uW
— POE PCB/PCBA Manufacturer (@poe_pcba) May 14, 2026