HDI PCB MANUFACTURING
PCB form the backbone of electronic devices, but traditional PCB manufacturing techniques are reaching their limitations in providing what modern electronics demand. That's where high-density interconnect (HDI) printed circuit boards come in. Using advanced design and manufacturing techniques, HDI PCBs enable higher densities, speeds, and functionality within a compact footprint.
Here at POE, we provide custom HDI PCB design and manufacturing services to help our clients realize their most advanced electronics projects. Our expert HDI engineers and technicians utilize the latest technologies to create high-performance PCB solutions that meet the needs of today’s demanding electronics market.
What are High-Density Interconnect PCBs?
High-density interconnect (HDI) printed circuit boards are advanced PCBs that incorporate technologies allowing for much higher component densities, finer circuit traces, and superior performance. Compared to traditional PCBs, HDI PCBs feature:
Higher layer counts - HDI PCBs typically have 6 to 14 circuit layers stacked vertically. This provides more spaces for components and interconnects.
Build-up technology - Additional dielectric and copper layers are deposited on the surface of HDI PCBs, creating extra interconnect levels.
Finer circuit traces - HDI PCB traces can be as thin as 10-30 μm, allowing for denser routing between components.
Microvias - Instead of plated through-holes, microvias with diameters under 100 μm provide vertical interconnects between circuit layers.
Embedded passive components - Resistors, capacitors and inductors can be directly embedded within HDI PCB layers, further reducing board area needs.
3D interconnects - HDI PCBs utilize both vertical and horizontal circuit layers, maximizing density in 3 dimensions.
Fine pitch SMT - HDI PCBs allow for very small pitch (0.3 mm or less) surface mount components, integrating more parts into limited space.
The result of using these advanced technologies is that HDI PCBs can contain 3 to 10 times as many components as traditional PCBs within the same footprint. This miniaturization enables the high performance, compact electronics that consumers demand today.
Here at POE, our HDI PCB services include:
Design - Our HDI engineers can design custom HDI PCBs based on your system requirements and specifications. We help optimize the layout to maximize density and performance while meeting manufacturability rules.
Simulation - We utilize advanced EDA tools to simulate signal and power integrity, thermal performance, and EMC/EMI compliance of your HDI PCB design prior to manufacturing.
Manufacturing - Our HDI PCB fabrication capabilities include:
• Layer counts up to 24 layers
• Trace widths down to 10 μm
• Microvia diameters as small as 30 μm
• Build-up technology with up to 8 dielectric layers
• Embedded passive components
• Rigorous testing to verify design requirements
Prototyping - We can produce small quantities of your HDI PCB design for validation and testing before moving into full production.
PCB Assembly - Our SMT assembly capabilities include fine pitch components to 0.3 mm, allowing population of your HDI PCB designs.
Full Turnkey Solutions - We work with you from initial concept through mass production to deliver the high performance HDI PCBs your product needs.
The Key Challenges of HDI PCB Design
Signal Integrity - The tiny traces and high speeds of HDI PCBs require sophisticated SI analysis and mitigation strategies to ensure clean signals.
Power Integrity - Dense power planes and short trace lengths increase supply noise and IR drops, so careful PI design is critical.
Thermal Management - The heat from closely packed components requires robust thermal simulations and heat mitigation strategies.
Manufacturability - HDI PCB design rules are strict, and some features may require specialized manufacturing processes.
Reliability - Decreased trace widths, via sizes and layer stack-ups reduce reliability margins; design must account for potential failure modes.
At POE, our team of experienced HDI PCB engineers is well-versed in tackling these challenges. Using specialized tools and techniques, we design reliable, manufacturable HDI PCB solutions that meet your needs.
High-density interconnect PCB technology enables the next leap forward in electronic functionality, performance, and miniaturization. Here at POE, we offer comprehensive HDI PCB design and manufacturing services, from initial concept through production. Our team's expertise in the unique challenges of HDI PCBs enables us to deliver reliable, high-quality solutions that make your products stand out. If you have an advanced electronics project that requires compact, high-performance PCBs, please contact us. We'd love to discuss how our HDI PCB services can help you realize your projects.