Layer count | 1-6 layers (flex area) and up to 20 |
Material | Polyimide, FR-4, and FR-4 High-Tg |
Board Thickness | Flexible area: 0.05mm – 0.3mm, Rigid area: 0.5mm – 3.2mm |
Copper Thickness | 1/3 Oz (12 µm) – 2 Oz (70 µm), depends on design and material requirements |
Minimum Trace Width/Spacing | 3mil/3mil (0.0762mm/0.0762mm) or better, depending on design and materials |
Minimum Hole Size | 0.2mm (8mil) or larger, depending on layer count |
Aspect Ratio | 10:1 or better |
Max Board Size | 400mm x 500mm |
Surface Finish | ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, etc |
Solder Mask | Green, Blue, Yellow, Black, Red, White, and other colors |
Solder Mask Resolution | 4mil (0.1mm) minimum |
Solder Mask Registration | ±2mil (±0.0508mm) |
Silkscreen Color | White, Black, Yellow |
Coverlay | Polyimide, with or without adhesive, depending on the application requirements |
Plated Through Holes (PTH) | Yes |
Blind & Buried Vias (BBV) | Yes |
Controlled Impedance | Yes, can be achieved in both rigid and flexible areas |
Stiffeners | FR-4, Polyimide, or Stainless Steel, installed to provide support and rigidity when needed |
Electrical Testing | Continuity & isolation, impedance control, Hi-Pot, etc. |
Mechanical Assembly | Supported |
Certification | ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard |
*If you need bare PCB manufacturing + component assembly, then you need to provide gerber file and bom.
Email: all@poe-pcba.com