Layers
1-6 layers (flex area) and up to 20
Material
Polyimide, FR-4, and FR-4 High-Tg
Board Thickness
Flexible area: 0.05mm – 0.3mm, Rigid area: 0.5mm – 3.2mm
Copper Thickness
1/3 Oz (12 µm) – 2 Oz (70 µm), depends on design and material requirements
Minimum Trace Width/Spacing
3mil/3mil (0.0762mm/0.0762mm) or better, depending on design and materials
Minimum Hole Size
0.2mm (8mil) or larger, depending on layer count
Aspect Ratio
10:1 or better
Max Board Size
400mm x 500mm
Surface Finish
ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, etc
Solder Mask
Green, Blue, Yellow, Black, Red, White, and other colors
Solder Mask Resolution
4mil (0.1mm) minimum
Solder Mask Registration
±2mil (±0.0508mm)
Silkscreen Color
White, Black, Yellow
Coverlay
Polyimide, with or without adhesive, depending on the application requirements
Plated Through Holes (PTH)
Yes
Blind & Buried Vias (BBV)
Yes
Controlled Impedance
Yes, can be achieved in both rigid and flexible areas
Stiffeners
FR-4, Polyimide, or Stainless Steel, installed to provide support and rigidity when needed
Electrical Testing
Continuity & isolation, impedance control, Hi-Pot, etc.
Mechanical Assembly
Supported
Certification
ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard
