Layers
Flexible area: 1-6 layers | Rigid area: up to 20 layers
Material
Polyimide, FR-4, and High-Tg FR-4 (Tg>170°C)
Board Thickness
Flexible area: 0.05mm – 0.3mm | Rigid area: 0.5mm – 3.2mm
Copper Thickness
0.5 Oz (18 μm) – 2 Oz (70 μm)
Minimum Trace Width/Spacing
Standard: 3mil/3mil (0.076mm) | Advanced: down to 2mil/2mil (0.051mm)
Minimum Hole Size
Mechanical drilling: 0.2mm (8mil) | Laser drilling: down to 0.1mm (4mil)
Aspect Ratio
Standard: 10:1 | Advanced: up to 12:1 for special applications
Max Board Size
400mm x 500mm
Surface Finish
ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, Immersion Tin
Solder Mask
Green, Blue, Yellow, Black, Red, White, and custom colors available
Solder Mask Resolution
4mil (0.1mm) minimum
Solder Mask Registration
±2mil (±0.051mm)
Silkscreen Color
White, Black, Yellow
Coverlay
Polyimide, with or without adhesive, customized for specific application requirements
Plated Through Holes (PTH)
Yes, with high reliability plating process
Blind & Buried Vias (BBV)
Yes, supporting complex HDI designs
Controlled Impedance
Yes, in both rigid and flexible areas with ±10% tolerance
Dynamic Flex Cycles
100,000+ cycles, with minimum bend radius of 0.8mm
Flex-to-Rigid Transition
Proprietary process ensuring high reliability at transition zones
Stiffeners
FR-4, Polyimide, or Stainless Steel, precision-installed for optimal support
Electrical Testing
100% testing: Continuity & isolation, impedance control, Hi-Pot testing
Mechanical Assembly
Full turnkey assembly services available
Lead Time
Standard: 15-20 working days | Expedited: 7-10 working days
Certification
ISO9001:2015, ISO13485:2016, ROHS, UL 94V-0, IPC-600G Class II and IPC-6012B Class II
Application Areas
Medical devices, Aerospace, Automotive, Consumer electronics, Industrial equipment
