Advanced PCB manufacturing (HDI PCB, Rigid Flex PCB, Flex PCB, Multilayer PCB(4-40 Layers), High Frequency PCB, Rogers PCB, Impedance control PCB, Blind buried via PCB) from prototype to mass production
Single to 40-layer multilayer PCB capability
Flex PCB 0.1mm to rigid-flex 6.0mm range
Ultra-fine line for HDI and high-density PCB
Laser micro via for HDI blind buried via PCB
Heavy copper up to 13oz for power PCB
Premium finish for high frequency Rogers PCB
Precision tolerance for rigid-flex PCB
Large format multilayer PCB capability
Precise impedance for high frequency PCB
Advanced HDI any-layer via structure
Rogers PCB, flex PCB high-temp materials
Fast turnaround for prototype to production
Our state-of-the-art PCB manufacturing facility spans 15,000 square meters with advanced production lines capable of producing single-layer to 40-layer PCBs. Equipped with the latest HDI technology, multilayer lamination systems, and precision drilling equipment, we serve industries requiring the highest quality standards. Our PCB manufacturing capabilities include rigid PCBs, flexible PCBs, rigid-flex combinations, and specialty materials like Rogers, Polyimide, and ceramic substrates for high-frequency and high-temperature applications.

Premium FR4 substrate preparation and cutting

UV lithography for inner layer patterning

Photoresist application and exposure process

Chemical removal of unwanted copper traces

Automated optical verification of inner circuits

Oxide treatment for layer adhesion

Multi-layer PCB pressing and bonding

High-precision via and mounting hole drilling

Photoresist removal after processing

Plated through-hole copper deposition

External layer photoresist patterning

Electroplating copper in drilled holes

Final copper trace definition and cleaning

Final circuit pattern verification

X-ray inspection of internal connections

Protective coating application and curing

Component legends and marking printing

Moisture-free protective packaging




Heavy copper PCB for high-current applications

Rogers and PTFE materials for RF applications

Aluminum and copper core for thermal management

High-temperature ceramic substrate solutions

Advanced via-in-pad technology for BGA designs

Complex via structures for high-density designs

Precise impedance matching for high-speed signals

PCBs optimized for automated assembly
State-of-the-art PCB manufacturing equipment and processes
24H prototype, 3-5 days production, express options available
IPC Class 2/3, ISO9001, UL certified manufacturing
DFM analysis and PCB layout optimization services