Layers
1-40+ layers (High-density multilayer capability)
Assembly Type
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size
01005 or 0201 (Imperial) / 0402 or 0603 (Metric)
Maximum Component Size
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc.
BGA Capability
Fine-pitch BGA down to 0.4mm, >99.5% first-pass yield
Minimum Pad Pitch
0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width
0.10 mm (4 mil)
Minimum Trace Spacing
0.10 mm (4 mil)
Minimum Drill Size
0.15 mm (6 mil)
Special Drilling Capability
Blind/Buried vias, Stacked vias, Back drilling
Maximum Board Size
18 in x 24 in (457 mm x 610 mm)
Maximum Board Thickness
0.062 in (1.6 mm) to 0.125 in (3.2 mm)
Board Material
FR-4, High-Tg FR-4, Aluminum, High Frequency (Rogers, Taconic, Isola), Flexible(FPC), Rigid-Flex
Impedance Control
±10% tolerance, controlled differential pairs
Surface Finish
HASL, ENIG (Immersion Gold), Gold Finger, OSP, Immersion Silver, ENEPIG
Solder Paste Type
Leaded or Lead-Free (SAC305, SN100C)
Assembly Process
Reflow Soldering, Wave Soldering, Selective Soldering, Hand Soldering
Thermal Management
Copper coin insertion, Heavy copper (up to 10oz), Heat sink assembly
Inspection Methods
Automated Optical Inspection (AOI), X-ray (2D/3D), Visual Inspection, SPI (Solder Paste Inspection)
Testing Methods
In-Circuit Test (ICT), Functional Test (FCT), Flying probe test, Boundary scan (JTAG)
Reliability Testing
Thermal cycling, Humidity testing, Vibration testing, HAST
Design for Manufacturing (DFM)
Comprehensive DFM Analysis and Feedback, Design optimization
Turnaround Time
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks
PCB Assembly Standards
ISO9001:2015, ISO13485:2016, ROHS, UL 94v0, IPC-A-610 Class 2/3, IPC-600G Class 2, IPC-6012B Class 2
Environmental Compliance
RoHS, REACH, WEEE, Conflict Minerals Compliance
Solar Panel PCBA Expertise
Specialized in high-efficiency solar inverters, charge controllers, and monitoring systems
