Full in-house service from component sourcing to final assembly — prototype to mass production, IPC Class 3 certified.
| Parameter | Specification |
|---|---|
| SMT Production Lines | 4 High-speed Automated SMT Lines |
| Daily Capacity | 300,000 CPH (Components Per Hour) |
| Monthly Capacity | Up to 500,000+ units / month |
| Minimum Component Size | 01005 (0402 Metric) |
| BGA Minimum Pitch | 0.35mm | uBGA, QFN, CSP supported |
| Placement Accuracy | ±0.025mm (Cpk ≥ 1.67) |
| Solder Paste | Lead-free (SAC305) & Leaded — RoHS compliant |
| Stencil Thickness | 0.08mm — 0.20mm (laser-cut stainless steel) |
| Reflow Atmosphere | Nitrogen (N₂) atmosphere available |
| Soldering Process | Reflow, Wave, Selective, Hand Soldering |
| DIP / Through-hole | Automated & semi-automated insertion lines |
| Board Size | Min 50×50mm — Max 460×460mm |
| Board Thickness | 0.4mm — 6.0mm |
| Production Volume | 1 pc prototype to 500,000+ pcs/month — no MOQ |
| Lead Time (Prototype) | 48 hours express available |
| Lead Time (Production) | 15–20 working days (standard) |
| Inspection / Test | Equipment & Standard |
|---|---|
| Solder Paste Inspection (SPI) | 3D SPI — pre & post print verification |
| Automated Optical Inspection (AOI) | 100% board coverage |
| X-Ray Inspection | BGA, QFN, void ratio analysis |
| In-Circuit Testing (ICT) | No fixture for prototypes |
| Functional Testing (FCT) | Custom fixtures — real operating condition simulation |
| Burn-in Testing | Extended thermal stress screening for reliability |
| Process Standard | IPC-A-610 Class 2 & Class 3 |
| Soldering Standard | IPC J-STD-001 |
| Quality Certifications | ISO 9001:2015 · ISO 13485:2016 · ISO 14001:2015 |
| Traceability | Full batch tracking — FAI, SPC, COC reports available |
| NDA & IP Protection | NDA signed before file receipt — restricted access controls |
| Service | Details |
|---|---|
| DFM Analysis | Free DFM review — BOM & Gerber verification before production |
| BOM Sourcing | Authorized distributors only: Digi-Key, Mouser, Arrow, Avnet, Future Electronics |
| Conformal Coating | Acrylic, silicone, polyurethane, epoxy — selective or full coverage |
| Potting & Encapsulation | Full potting for harsh environment and waterproofing applications |
| IC Programming | On-board and off-board IC programming services |
| Box Build Assembly | Complete product assembly — enclosures, cables, final packaging |
| Quick Prototyping | 48-hour express service available |
| Technical Support | Engineering team available for DFM, BOM review, and process consultation |
Incoming inspection of all PCBs and components.
SPI-verified precise paste application.
±0.025mm placement accuracy, 01005 capable.
Nitrogen atmosphere, precise temperature profile.
Automated insertion with wave soldering.
AOI, X-Ray, ICT, FCT, burn-in.
Coating, potting, IC programming, box build.
Custom packaging with full traceability documentation.
Authorized distributors only. Full COC documentation, transparent BOM pricing, and early warnings for component shortages on every order.
Partnerships with authorized distributors worldwide ensuring genuine components and stable supply.
Expert component substitution to reduce costs and mitigate supply chain risks.
"Procure and manage" services to reduce your capital investment and storage needs.
Early warnings for component shortages and end-of-life parts to prevent production delays.
Multi-stage inspection at every production step — from incoming materials to final shipment. IPC-A-610 Class 3 certified.
High-resolution cameras detect soldering defects and component placement issues.
Critical for BGA inspection, verifying solder joints and internal connections.
Verifies component presence, orientation, and values for manufacturing defects.
Simulates real-world operating conditions to ensure proper functionality.
Extended operation under elevated temperatures to identify early failures.
Adherence to IPC-A-610 Class 2/3 standards with comprehensive documentation.
Advanced PCBA solutions for generalist superhumanoid robots capable of performing all core warehouse tasks.
High-reliability PCBA for aerospace data recording systems operating in harsh environments.
From bare PCB prototyping to PCBA sample production and planned bulk manufacturing transfer from Europe to China.