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Rigid Flex PCB | POE
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20+ Years
Rigid‑Flex PCB Expertise in China

POE has specialized in bare rigid‑flex PCB and flexible PCB manufacturing since 2011, focusing on medium‑to‑small production runs with fast turnaround. Our capabilities cover design validation, stack‑up optimization, controlled impedance, and reliability for dynamic bend regions.

With a 3,000 m² electronics facility equipped for inspection and reliability testing (AOI, X‑ray, microsection, reliability bend testing), we deliver high‑quality bare rigid‑flex PCBs ready for your assembly line. Engage us for engineering reviews to reduce risk in flex‑to‑install zones and stiffener transitions.

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WHAT CAN POE
DO FOR RIGID-FLEX?

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No MOQ,
24/7 Engineering Support

Quick Rigid‑Flex
Prototypes in 5–7 Days

1–100,000+ Batches
Factory‑Direct Pricing

2–20 Layers Rigid‑Flex
Blind/Buried/HDI Options

Impedance Control, Back‑drill, Via Plugging; Balanced/Unbalanced Structures

UL, ISO9001, ISO14001,
RoHS Compliant

Free DFM/DFX Review
for Rigid‑Flex

Fast Quotations,
Replies Within 4 Hours

One‑Stop Customization:
Stack‑up to Reliability

99.8%+ Customer Satisfaction

APPLICATION SHOWCASE

Share your Gerber, stack‑up intent, and impedance targets—POE manufactures high‑reliability bare rigid‑flex PCBs for demanding applications. From tight bend radii and dynamic flex regions to dense interconnects, our process controls and materials expertise ensure consistent mechanical endurance and signal integrity across prototypes and production volumes.

Consumer Devices
Consumer Devices
Renewable Energy
Renewable Energy
Smart Agriculture
Smart Agriculture
Industrial Automation
Industrial Automation
Medical Devices
Medical Devices
Security Systems
Security Systems
Telecom & IoT
Telecom & IoT
Robotics
Robotics
RF & Wireless
RF & Wireless
Others:

POE RIGID-FLEX PCB
CAPABILITIES

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Specifications
POE's Rigid‑Flex PCB Capabilities
1
PCB Layers
Rigid‑Flex: 2 to 20 total layers; mixed rigid/flex constructions
2
Order Quantity
1–100,000+ pcs
3
Lead Time
Prototypes 5–7 days; Production 1–4 weeks (contact us for exact lead time)
4
Base Materials
PI (Polyimide) or PET, RA (rolled‑annealed) or ED copper, adhesive or adhesive‑less
5
Inspection & Test
AOI, FAI, X‑RAY, microsection, impedance test, electrical test
6
Flex Thickness
0.05 mm to 0.35 mm (0.20 mm typical)
7
Min Trace/Space
1.6 mil / 1.6 mil (tighter by inquiry)
8
Copper Weight
1/3 oz to 3 oz (flex and rigid sections)

RIGID FLEX PCB
MANUFACTURING PROCESS

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01
Substrate Preparation
Substrate Preparation
02
Photoresist Lamination
Photoresist Lamination
03
Drilling & Via Formation
Drilling & Via Formation
04
Imaging / Exposure
Imaging / Exposure
05
Developing
Developing
06
Circuit Etching
Circuit Etching
01
Substrate Preparation
Substrate Preparation
02
Photoresist Lamination
Photoresist Lamination
03
Drilling & Via Formation
Drilling & Via Formation
04
Imaging / Exposure
Imaging / Exposure
05
Developing
Developing
06
Circuit Etching
Circuit Etching

CERTIFICATIONS

POE complies with multiple international standards, including ISO9001:2015, ISO14001:2015, ISO13485:2016, REACH, RoHS, UL, and IPC. We are a reliable manufacturer of bare rigid‑flex PCBs with strict process controls and traceability.

ISO9001

ISO9001

ISO14001

ISO14001

ISO13485

ISO13485

REACH

REACH

IPC

IPC

SGS

SGS

RoHS

RoHS

RoHS
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
phone UL phone UL phone UL phone UL phone UL phone UL

PACKING & SHIPPING

Global logistics (expedited options available)

Rigid‑flex PCBs are packaged to protect flex tails, controlled‑bend zones, and exposed copper. Each lot is tracked by traveler ID, vacuum sealed with desiccant where required, cushioned with ESD‑safe materials, and boxed for safe transport. We ship worldwide with door‑to‑door service.


01. Products
Finished bare rigid‑flex PCBs after final inspection and E‑test

02. ESD Bags
ESD‑safe packaging with moisture protection if required

03. Cushioning
Bubble wrap and corner protection for flex tails and rigid sections

04. Carton Packaging
Labeled cartons with batch tracking and handling instructions

05. Ready to Ship
Dispatch via express, air, or sea per your instructions

05. Ready to Ship
Dispatch via express, air, or sea per your instructions

RIGID-FIEX
ORDER PROCESS

Get A Quote
01

Consultation

Send Gerber/requirements to
all@poe-pcba.com

02

Quotation

Receive a tailored quote
within 24 hours

03

Order Confirmation

Confirm PO and specs
with our engineers

04

DFM/EQ

DFM for rigid‑flex & bend
zones; resolve EQ items

05

Prototype

Start build; typical 5–7 days
depending on layer count

06

Production

Scale to volume; 1–4 weeks
per quantity & complexity

07

Logistics

Worldwide shipping
door‑to‑door

08

Receipt & Support

Receive boards; we provide
timely after‑sales support

EXHIBITION
SHOWCASE

Meet POE at global electronics exhibitions to discuss stack‑ups, materials, bend radius strategies, stiffener choices, impedance control, and reliability validation for your rigid‑flex projects. Bring your requirements—we’ll provide manufacturability insights and quick quoting.

Learn More
APEX EXPO IPC 2024
Global Sources Electronic
Hong Kong Exhibition
AMPER 2024
Electronica 2024 Germany

CUSTOMER FEEDBACK
AND VIDEO REVIEWS

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Recent Rigid‑Flex Orders

User Name Date QTY Price

NEWS & EVENTS

Major Events
Video
Magazine
image 1

(2025) Rigid‑Flex Capability Expansion

POE has upgraded rigid‑flex imaging and lamination lines to support tighter registration and higher‑layer builds, improving yield and consistency for complex designs.

2025/01/12

image 2

Process Control for Flex Reliability

We refined bend‑zone copper handling and coverlay processes to enhance dynamic flex life and reduce risk in flex‑to‑install applications.

2024/12/25

image 3

Materials Library Updated

Added new PI cores, adhesive‑less options, and RA copper foils to better support high‑frequency and high‑reliability rigid‑flex designs.

2024/11/11

(2025) Rigid‑Flex Capability Expansion
New imaging and lamination upgrades further improve layer registration and yield on complex mixed constructions.
Process Control for Flex Reliability
Enhanced copper handling in bend zones and optimized coverlay windows to extend dynamic flex life.
Materials Library Updated
Expanded PI cores and RA copper options supporting high‑frequency and high‑reliability rigid‑flex applications.
2024 POE Annual Conference
Reviewing a year of process improvements and customer success in rigid‑flex manufacturing.
POE Rigid‑Flex Overview 4:30
How to Place a Rigid‑Flex Order 5:00
Rigid‑Flex Fabrication Flow 3:00
Soldering Considerations (For Assembly) 3:00
Conformal Coating Guidelines 3:00
Quality Control in Production 4:30
AOI for Rigid‑Flex 5:00
Learn more    
2024 Oct.–Dec. POE Magazine
2024 July–Sept. POE Magazine
2024 April–June POE Magazine
2024 Jan.–Mar. POE Magazine
2023 Nov.–Dec. POE Magazine
2023 Sep.–Oct. POE Magazine
2023 Jul.–Aug. POE Magazine
Learn more     

REQUEST A FREE CONSULTATION

Tell us your rigid‑flex requirements, target quantities, and constraints. Upload drawings or Gerber files—we’ll respond with a free quote and manufacturability feedback.

We stand behind our quality for all rigid‑flex PCBs.

24/7 After‑Sales Support.

We can sign an NDA before file transfer to protect your IP and design data.

Request Information