A full-capability PCBA manufacturing center in Shenzhen — SMT, DIP, testing, sourcing, and box-build under one roof for clients across medical, industrial, IoT, and telecommunications sectors.
Click any step to see the equipment and process detail. Every assembly passes through the full sequence before leaving our facility.
Seamless board feeding system ensures precise positioning and gentle handling for optimal production flow at the start of every SMT assembly run.
Our nitrogen reflow soldering equipment features an advanced 10-zone precision control system, ensuring precise temperature curve control throughout the soldering process. The nitrogen atmosphere eliminates oxidation, producing cleaner solder joints with significantly fewer defects compared to conventional air reflow.
Complete SMT and DIP assembly service. From single prototype to high-volume production, with full BOM sourcing, stencil preparation, and multi-stage inspection included.
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35 dedicated procurement engineers. BOM quotations within 24 hours. Competitive pricing through 10+ years of distributor relationships across China and internationally.
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Rapid assembly prototyping from 24 hours. DFM review and BOM check included. Ideal for engineering validation before committing to production volumes.
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Comprehensive functional testing, ICT, flying probe, AOI, and X-ray BGA inspection. Every assembly is verified against specification before shipment.
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Inventory management, consignment handling, and supply chain optimization. We manage your components so you can focus on your product.
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Full OEM contract manufacturing from bare board to finished product. We handle production, testing, packaging, and direct shipment to your customers.
Protective coating for harsh environment applications — moisture, dust, chemical, and thermal protection for boards deployed in demanding conditions.
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Firmware programming and microcontroller flashing as part of the assembly process. Supports a wide range of MCUs, FPGAs, and memory devices.
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Custom wire harness and cable assembly solutions. Designed and built to your specifications, integrated directly into your final product assembly.
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Complete system integration from PCB to finished enclosure. We assemble, test, and package your product ready for end-user delivery.
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Professional kitting, carton boxing, and foam packaging services. Custom packaging designed to protect your product and reflect your brand.
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Custom 3D printed enclosures for prototypes and low-volume production. Fast turnaround, multiple materials, and direct integration with your PCBA.
View Capabilities →PCB fabrication, component sourcing, PCBA, testing, and packaging under one roof. No coordination overhead, no handoff delays.
35 dedicated procurement engineers. Competitive pricing through 10+ years of distributor relationships across China and internationally.
AOI, X-ray BGA, flying probe, and functional testing at every critical stage. 99.9% quality pass rate across all production runs.
Deep experience in medical devices, 5G, robotics, IoT, and power supply — industries where precision and reliability are non-negotiable.
Floor 3, Jingyuan Industrial Park
No.56 Tangtou Avenue
Shiyan Town, Bao'an District
Shenzhen, China
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
