Layers
1-40+ layers (High-density multilayer capability for complex robotics control systems)
Assembly Type
Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT), Advanced Package-on-Package
Minimum Component Size
01005 or 0201 (Imperial) / 0402 or 0603 (Metric) - Essential for miniaturized robotics applications
Maximum Component Size
2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) - Accommodating larger power components
Component Package Types
BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, specialized robotics modules
Minimum Pad Pitch
0.4 mm (16 mil) for QFP/QFN, 0.5 mm (20 mil) for BGA - Supporting high-density robotics controllers
Minimum Trace Width
0.10 mm (4 mil) - Precision manufacturing for complex routing in motion control systems
Minimum Trace Spacing
0.10 mm (4 mil) - Enabling high-density interconnects for sensor arrays
Minimum Drill Size
0.15 mm (6 mil) - Precision micro-vias for multi-layer robotics PCBs
Maximum Board Size
18 in x 24 in (457 mm x 610 mm) - Suitable for industrial robotics control panels
Maximum Board Thickness
0.062 in (1.6 mm) to 0.125 in (3.2 mm) - Optimized for robotics applications
Board Material
FR-4, High-Tg FR-4, Aluminum (for thermal management), Flexible(FPC for moving parts), Rigid-Flex (for articulated joints)
Surface Finish
ENIG (for fine-pitch components), HASL, Gold Finger (for edge connectors), OSP, Immersion Silver
Solder Paste Type
Leaded or Lead-Free (RoHS compliant) - High-reliability formulations for robotics applications
Assembly Process
Advanced Reflow Soldering, Selective Wave Soldering, Precision Hand Soldering for specialized components
Inspection Methods
Automated Optical Inspection (AOI), X-ray (AXI) for BGA inspection, 3D Solder Paste Inspection (SPI)
Testing Methods
In-Circuit Test (ICT), Functional Test (FCT), Flying probe test, Motor driver and sensor validation
Design for Manufacturing (DFM)
Comprehensive DFM Analysis and Expert Feedback, Design Optimization for robotics applications
Turnaround Time
Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks - Expedited services available
Robotics-Specific Capabilities
Motor driver circuits, sensor integration, power management systems, embedded controller assembly
Certifications & Standards
ISO9001:2015, ISO13485:2016, ROHS, UL 94V0, IPC-A-600G Class II/III, IPC-6012B Class II/III
