From onboard charger control boards to DC fast charge power modules — we manufacture the PCBs and PCBAs inside electric vehicle charging systems.
Every board inside an EV charger — from the pilot signal circuit to the high-voltage gate driver — we manufacture it.
High-voltage isolated gate driver PCBAs for IGBT and SiC MOSFET switching stages. PFC controller boards, LLC resonant converter control modules, and DC-DC converter PCBAs for EV charger power stages.
EVSE controller PCBAs with pilot signal generation, proximity detection, and relay control. OCPP communication modules, CAN bus interface boards, CHAdeMO and CCS Combo protocol PCBAs.
MID-compliant energy metering PCBAs, ground fault detection boards, residual current monitoring modules, and over-voltage / over-current protection circuits for AC and DC charging systems.
HMI controller PCBAs for touchscreen and button interfaces, LED status indicator boards, RFID reader modules for access control, and LCD/TFT display driver boards for public charging stations.
Liquid cooling pump and fan controller boards, NTC temperature monitoring PCBAs, thermal runaway detection modules, and heat sink interface boards for high-power charging systems.
Bidirectional onboard charger control PCBAs, Vehicle-to-Grid (V2G) communication boards, ISO 15118 protocol modules, and BMS interface PCBAs for smart charging and energy management.
High voltage, high current, outdoor exposure, and safety-critical operation — EV charger PCBAs face conditions that demand a different level of manufacturing discipline. POE builds to that standard.
EV charger boards operate at 400 V to 1000 V DC. We manufacture to IPC-2221 creepage and clearance requirements, use high-CTI materials where needed, and apply conformal coating for additional isolation in humid environments.
High-current paths in charger power boards require 2 oz to 6 oz copper. We fabricate heavy copper PCBs, design thermal via arrays under power components, and use aluminum-core substrates for direct heat dissipation.
SiC and GaN switching at hundreds of kHz generates significant EMI. We review PCB stackup, ground plane continuity, and decoupling placement before fabrication to help your design pass CE and FCC testing.
We understand the certification requirements your product must meet. Our manufacturing process, material traceability, and inspection documentation are structured to support your IEC 61851, UL 2594, and CE marking certification audits.
PCB Fabrication
| Parameter | Specification |
|---|---|
| Layer Count | 1 to 40 layers |
| Material | FR4, High-Tg FR4, Aluminum, Rogers, Ceramic |
| Copper Weight | 0.5 oz to 6 oz (heavy copper available) |
| Min Trace / Space | 3/3 mil standard; 2/2 mil HDI |
| Board Thickness | 0.4 mm to 6.0 mm |
| Max Board Size | 600 mm x 500 mm |
| Surface Finish | HASL, ENIG, OSP, ENEPIG, Immersion Ag/Sn |
| Impedance Control | +/-5% standard; +/-3% precision |
| Prototype Lead Time | 24 hours |
PCBA Assembly
| Parameter | Specification |
|---|---|
| Assembly Type | SMT, through-hole, mixed, press-fit |
| Min Component | 0201 imperial; 01005 advanced |
| Min BGA Pitch | 0.4 mm |
| Placement Accuracy | +/-0.025 mm (Cpk ≥ 1.67) |
| Solder | Lead-free SAC305; leaded SnPb available |
| Reflow | 8-zone nitrogen atmosphere oven |
| Inspection | SPI, AOI, 2D/3D X-Ray, ICT, flying probe |
| Protection | Conformal coat, potting, underfill |
| Quality Standard | IPC-A-610 Class 2 / Class 3 |
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
