Expert BGA assembly with advanced equipment and skilled technicians. We deliver high-quality, reliable BGA PCB solutions for complex electronic applications.
Contact UsOur advanced BGA placement equipment ensures precise alignment and soldering of complex BGA components with accuracy down to 0.01mm.
Every BGA assembly undergoes X-ray inspection and thermal testing to ensure perfect solder joints and reliable performance in demanding environments.
We understand time-to-market pressures. Our optimized BGA assembly process delivers completed boards in as little as 3-5 days for standard orders.
Our engineers analyze your BGA PCB design for manufacturability, thermal management, and signal integrity to ensure optimal performance.
Custom laser-cut stencils are created for precise solder paste application to BGA pads, ensuring consistent solder volume.
Automated solder paste printing with optical inspection ensures perfect paste deposition for reliable BGA connections.
Advanced pick-and-place machines with optical alignment systems position BGA components with ±0.01mm accuracy.
Multi-zone reflow ovens with nitrogen atmosphere and precise temperature profiles ensure perfect BGA solder joints.
100% X-ray inspection of BGA solder joints to verify connection quality and identify any hidden defects.
State-of-the-art BGA placement and X-ray inspection systems
IPC-certified specialists with 10+ years BGA experience
100% X-ray inspection and electrical verification
Expedited 24-48 hour service available
Professional BGA removal, reballing, and replacement services. We can repair damaged BGA components or upgrade existing boards with new BGAs using specialized equipment for perfect results.
Our engineering team provides expert advice on BGA footprint design, thermal management, signal integrity, and power delivery optimization to ensure your BGA-based designs perform reliably in production.