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BGA PCB Assembly Services | POE
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Professional BGA PCB Assembly Services

Expert BGA assembly with advanced equipment and skilled technicians. We deliver high-quality, reliable BGA PCB solutions for complex electronic applications.

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Why Choose Our BGA PCB Assembly Service

Precision Technology

Our advanced BGA placement equipment ensures precise alignment and soldering of complex BGA components with accuracy down to 0.01mm.

Quality Assurance

Every BGA assembly undergoes X-ray inspection and thermal testing to ensure perfect solder joints and reliable performance in demanding environments.

Fast Turnaround

We understand time-to-market pressures. Our optimized BGA assembly process delivers completed boards in as little as 3-5 days for standard orders.

BGA PCB Assembly Specifications

Specification
Details
BGA Package Types
PBGA, CBGA, MBGA, FBGA, CSP, LBGA, TBGA, TEPBGA
BGA Pitch Range
0.4mm to 1.27mm pitch
Ball Count
Up to 2500 balls per component
Minimum Ball Size
0.2mm diameter
Board Thickness
0.4mm to 3.2mm
Board Layers
2 to 40 layers
Board Materials
FR-4, High-Tg FR-4, Rogers, Polyimide, Ceramic
Solder Types
Lead-free SAC305;
Leaded Sn63/Pb37;
High-temperature solder options
Placement Accuracy
±0.01mm
Reflow Profile
Standard;
Custom profiles for special applications
Minimum Order
1 piece (prototype);
10+ pieces (production)
Turnaround Time
3-5 days standard;
24-48 hours expedited service;
7-10 days for complex multi-BGA designs

Our BGA Assembly Process

1

Design Review

Our engineers analyze your BGA PCB design for manufacturability, thermal management, and signal integrity to ensure optimal performance.

2

Stencil Preparation

Custom laser-cut stencils are created for precise solder paste application to BGA pads, ensuring consistent solder volume.

3

Solder Paste Application

Automated solder paste printing with optical inspection ensures perfect paste deposition for reliable BGA connections.

4

Precision Placement

Advanced pick-and-place machines with optical alignment systems position BGA components with ±0.01mm accuracy.

5

Controlled Reflow

Multi-zone reflow ovens with nitrogen atmosphere and precise temperature profiles ensure perfect BGA solder joints.

6

X-Ray Inspection

100% X-ray inspection of BGA solder joints to verify connection quality and identify any hidden defects.

Testing & Quality Assurance

Testing Type
Details
X-Ray Inspection
3D X-ray imaging for complete BGA joint inspection;
Void detection and measurement;
Ball alignment verification.
Thermal Testing
Thermal cycling from -40°C to +125°C;
Thermal imaging for hotspot detection.
Electrical Testing
Flying probe testing;
Boundary scan/JTAG testing;
Functional testing.
Reliability Testing
Highly Accelerated Stress Test (HAST);
Thermal shock testing;
Vibration and drop testing.
Certifications
ISO 9001:2015, IPC-A-610 Class 3, J-STD-001, RoHS, REACH

Our BGA Assembly Advantages

Advanced Equipment

State-of-the-art BGA placement and X-ray inspection systems

Expert Technicians

IPC-certified specialists with 10+ years BGA experience

Comprehensive Testing

100% X-ray inspection and electrical verification

Fast Turnaround

Expedited 24-48 hour service available

Special BGA Services

BGA Rework & Reballing

Professional BGA removal, reballing, and replacement services. We can repair damaged BGA components or upgrade existing boards with new BGAs using specialized equipment for perfect results.

BGA Design Consultation

Our engineering team provides expert advice on BGA footprint design, thermal management, signal integrity, and power delivery optimization to ensure your BGA-based designs perform reliably in production.