China 1-40layer PCB/PCBA/EMS/OEM
One stop contract Manufacturing facility
One stop contract Manufacturing facility
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| Abridge | Explain |
| PCB | Printed circuit board |
| PCBA | Printed circuit board assembly |
| FR4 PCB | The most commonly used materials in PCBs |
| Aluminum PCB | Commonly used in LED lighting, TV backlighting |
| Cem-1 PCB | Composite board, the board body is white, not easy to bend, only single-sided, simple structure, commonly used in the field of toys. |
| Rogers PCB | Refers to printed circuit boards consisting of high-performance materials manufactured by Rogers Corp. |
| HF & RF PCB | PCBs with higher frequency signals |
| Teflon PCB | PCBs that are resistant to acids and alkalis and are virtually insoluble in all solvents. |
| Impedance controlled board | It is a PCB that pays special attention to the impedance matching requirements of specific signal paths on the board during the design and manufacturing process. |
| HDI PCBs | High Density Interconnect Printed Boards with Better Performance and Smaller Size |
| PCB Layer | PCB has different number of layers according to different needs, the more layers the higher requirements |
| Multilayer PCB | / |
| Double layer PCB | / |
| Rigid PCB | Common PCB Types |
| FPC | PCBs that can be bent and folded |
| Stiffener | FPC-specific processes |
| Rigid-flex PCB | PCBs made from a combination of flexible and rigid boards. |
| Thick copper PCB | / |
| Surface finish treatment | / |
| HASL | Hot Air Solder Level, processes in PCB manufacturing |
| Lead-free HASL | Lead-free Hot Air Solder Level, processes in PCB manufacturing |
| Flash Gold | Rapid gold plating |
| ENIG | Immersion Gold |
| Gold Finger PCB | / |
| OSP | Organic Solderability Preservatives |
| Immersion Tin | / |
| Immersion Silver | / |
| Hard Gold | / |
| Drill/hole | / |
| laser drill | / |
| Minimum hole size | / |
| Mechanical drill | / |
| Minimum Annular Ring | / |
| Plugging Visa capability | / |
| Resin Filled/Plugging | / |
| Copper plugging | / |
| Lasering drilling | / |
| Via | / |
| Vias older mask opening | / |
| Vias solder mask filling | / |
| Vias solder mask covering | / |
| PTH | Plating Through Hole |
| NPTH | Non-Plated through holes |
| Stamp hole | / |
| slot hole | / |
| half hole | / |
| Countersink hole | / |
| Tolerance | / |
| Plated holes Tolerance | / |
| Non-plated hole tolerance | / |
| Outline Tolerance | / |
| Max Copper thickness | / |
| Max Production size | / |
| Min Solder Mask Bridge | / |
| Max PCB size | / |
| Min Solder Mask Bridge | / |
| Board Thickness | / |
| Aspect ratio | / |
| Line/Trace/Circuit | / |
| Minimun line width | / |
| Minimun line gap | / |
| Peel off strength | / |
| Thermal Stress tes | / |
| Solder mask hardness | / |
| E-Test voltage | / |
| Warp and Twist | / |
| Solder Mask | / |
| Insulating resistance | / |
| peelable mask | / |
| Impedance controlled | / |
| Fiducial Aligment point | / |
| TP | Test pad |
| EQ | Engineer question |
