What are the common terms used in the PCB industry?
21 January 2025
Views: 1654
PCB stands for printed circuit board. From everyday cell phones and computers to large mechanical devices, PCBs are needed for functionality. So what are some of the important terms commonly used in the PCB industry?
| Abridge |
Explain |
| PCB |
Printed circuit board |
| PCBA |
Printed circuit board assembly |
| FR4 PCB |
The most commonly used materials in PCBs |
| Aluminum PCB |
Commonly used in LED lighting, TV backlighting |
| Cem-1 PCB |
Composite board, the board body is white, not easy to bend, only single-sided, simple structure, commonly used in the field of toys. |
| Rogers PCB |
Refers to printed circuit boards consisting of high-performance materials manufactured by Rogers Corp. |
| HF & RF PCB |
PCBs with higher frequency signals |
| Teflon PCB |
PCBs that are resistant to acids and alkalis and are virtually insoluble in all solvents. |
| Impedance controlled board |
It is a PCB that pays special attention to the impedance matching requirements of specific signal paths on the board during the design and manufacturing process. |
| HDI PCBs |
High Density Interconnect Printed Boards with Better Performance and Smaller Size |
| PCB Layer |
PCB has different number of layers according to different needs, the more layers the higher requirements |
| Multilayer PCB |
/ |
| Double layer PCB |
/ |
| Rigid PCB |
Common PCB Types |
| FPC |
PCBs that can be bent and folded |
| Stiffener |
FPC-specific processes |
| Rigid-flex PCB |
PCBs made from a combination of flexible and rigid boards. |
| Thick copper PCB |
/ |
| Surface finish treatment |
/ |
| HASL |
Hot Air Solder Level, processes in PCB manufacturing |
| Lead-free HASL |
Lead-free Hot Air Solder Level, processes in PCB manufacturing |
| Flash Gold |
Rapid gold plating |
| ENIG |
Immersion Gold |
| Gold Finger PCB |
/ |
| OSP |
Organic Solderability Preservatives |
| Immersion Tin |
/ |
| Immersion Silver |
/ |
| Hard Gold |
/ |
| Drill/hole |
/ |
| laser drill |
/ |
| Minimum hole size |
/ |
| Mechanical drill |
/ |
| Minimum Annular Ring |
/ |
| Plugging Visa capability |
/ |
| Resin Filled/Plugging |
/ |
| Copper plugging |
/ |
| Lasering drilling |
/ |
| Via |
/ |
| Vias older mask opening |
/ |
| Vias solder mask filling |
/ |
| Vias solder mask covering |
/ |
| PTH |
Plating Through Hole |
| NPTH |
Non-Plated through holes |
| Stamp hole |
/ |
| slot hole |
/ |
| half hole |
/ |
| Countersink hole |
/ |
| Tolerance |
/ |
| Plated holes Tolerance |
/ |
| Non-plated hole tolerance |
/ |
| Outline Tolerance |
/ |
| Max Copper thickness |
/ |
| Max Production size |
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| Min Solder Mask Bridge |
/ |
| Max PCB size |
/ |
| Min Solder Mask Bridge |
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| Board Thickness |
/ |
| Aspect ratio |
/ |
| Line/Trace/Circuit |
/ |
| Minimun line width |
/ |
| Minimun line gap |
/ |
| Peel off strength |
/ |
| Thermal Stress tes |
/ |
| Solder mask hardness |
/ |
| E-Test voltage |
/ |
| Warp and Twist |
/ |
| Solder Mask |
/ |
| Insulating resistance |
/ |
| peelable mask |
/ |
| Impedance controlled |
/ |
| Fiducial Aligment point |
/ |
| TP |
Test pad |
| EQ |
Engineer question |
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