POE MANUFACTURING
YOUR GLOBAL TECHNOLOGY
PARTNER
| Substrate type | Level code | Composition materials | Characteristic | Application |
| Paper substrate | XPC | Phenolic resin/insulating paper | Economical, non-flame retardant | Toys, radios |
| XXPC | Modified phenolic resin/insulating paper | High electrical performance, non-flame retardant | Phone, calculator | |
| FR1 | Flame retardant phenolic resin/insulating paper | Economical, slightly higher flame retardancy | Automotive electronics, consumer electronics | |
| FR2 | Flame retardant modified phenolic resin/insulating paper | High electrical performance, flame retardant | Telephone, computer | |
| Glass cloth substrate | FR4 | Epoxy resin/glass cloth | Good mechanical strength and impact strength Excellent electrical resistance Very suitable for PTH production |
computer use mobile communication military supplies |
| FR5 | Improved epoxy resin/glass cloth | High temperature flexural strength is better than FR-4 Excellent electrical resistance |
military supplies | |
| Composite substrate | CEM-1 | Epoxy resin + paper core | Can be die cut at room temperature Strong flex and impact resistance Good electrical resistance |
consumer electronics |
| CEM-3 | Epoxy resin + glass fiber paper | Die cut at room temperature but harder than CEM-1 Strong flex and impact resistance Very good electrical resistance |
Computer peripherals | |
| HDI | RCC | The roughened surface of electrolytic copper foil (thickness ≤18um) is coated with one or two layers of high-performance resin | High precision and high density | Computer products, automotive electronics, phones, medical equipment |
Since 1996, POE has become a globally renowned PCB company, providing small to medium volume PCB/ PCBA manufacturing services.
