Precision Ball Grid Array assembly with 0.01mm placement accuracy, 100% X-Ray inspection, and IPC Class 3 quality standards. From 0.4mm pitch BGAs to 2500-ball packages we handle your most demanding designs.
Our BGA assembly line is equipped with the latest SMT placement machines and X-Ray inspection systems, capable of handling the full range of BGA package types and pitches.
High-precision SMT machines with vision alignment systems ensure every BGA ball lands exactly on its pad, even at 0.4mm pitch.
We support fine-pitch BGAs down to 0.4mm, including CSP, FBGA, and micro-BGA packages used in mobile and high-density designs.
From small 4-ball packages to high-density 2500-ball FPGAs and processors our equipment handles the full spectrum of BGA complexity.
Every BGA assembly undergoes full 2D/3D X-Ray inspection to verify solder joint integrity, detect voids, bridging, and missing balls.
All BGA assemblies are built and inspected to IPC-A-610 Class 3 the highest standard for mission-critical and high-reliability electronics.
Over two decades of BGA assembly experience across aerospace, medical, telecom, and industrial sectors. We have seen every challenge.
| Parameter | Specification |
|---|---|
| Package Types | BGA, CBGA, PBGA, FBGA, CSP, LGA, QFN, micro-BGA |
| Minimum Ball Pitch | 0.4mm (standard); 0.3mm (advanced process) |
| Maximum Ball Count | Up to 2500 balls per package |
| Package Size Range | 3mm 3mm to 60mm 60mm |
| Placement Accuracy | 0.01mm (Cpk 1.67) |
| Solder Paste | Lead-free SAC305; leaded SnPb63 available |
| Stencil Thickness | 0.08mm 0.15mm (step stencil for mixed pitch) |
| Reflow Profile | Nitrogen atmosphere; 8-zone controlled reflow |
| Board Thickness | 0.4mm 6.0mm |
| Max Board Size | 600mm 500mm |
| Method | Details |
|---|---|
| X-Ray Inspection | 2D/3D AXI 100% coverage for all BGA joints |
| AOI (Automated Optical) | Pre- and post-reflow AOI on all assemblies |
| ICT / Flying Probe | In-circuit test for functional verification |
| Void Rate | <10% void area per IPC-7095 standard |
| Quality Standard | IPC-A-610 Class 2 (standard) / Class 3 (high-rel) |
| Certifications | ISO 9001, ISO 13485, ISO 14001, RoHS, REACH |
| Traceability | Full component and process traceability per board |
| First Article Inspection | Available on request for new designs |
A controlled, repeatable 6-step process ensures every BGA assembly meets specification from the first prototype to full production volume.
Our engineers review your Gerber files, BOM, and assembly drawings. We check pad geometry, stencil apertures, thermal relief, and via-in-pad design before any material is ordered.
Laser-cut stainless steel stencils are produced to exact aperture specifications. Components are sourced from authorized distributors and verified against the BOM before kitting.
Automated solder paste printing with closed-loop SPI (Solder Paste Inspection) verifies paste volume, area, and offset on every board before placement begins.
High-accuracy pick-and-place machines with bottom-side vision alignment place each BGA to 0.01mm. Fiducial recognition and nozzle calibration are performed at the start of every run.
8-zone nitrogen reflow oven with tightly controlled thermal profiles. Profile is validated per IPC-7530 for each new assembly. Nitrogen atmosphere minimizes oxidation and improves wetting.
100% 2D/3D X-Ray inspection on every BGA. AOI and visual inspection complete the quality gate. Non-conforming boards are flagged for rework or rejection before shipment.
We use a multi-layer inspection strategy to catch defects at every stage not just at the end of the line.
Failed BGA? We offer professional BGA rework using hot-air rework stations with precision thermal profiles. Reballing service restores used or damaged BGAs to factory-new condition using fresh solder balls.
Our engineers work with your design team to optimize BGA layouts for manufacturability and reliability. Early DFM review prevents costly respins and assembly failures before production begins.
Email: all@poe-pcba.com
Whatsapp: 85292069596
Tel: 0755-25312250/ +8613798543496
Factory Address: Floor 3, Jinyuan Industrial Park, No. 56, Tangtou Avenue, Shiyan Town, Baoan District, Shenzhen China
