POE MANUFACTURING
YOUR GLOBAL TECHNOLOGY
PARTNER
| SMC-TR-001 | SMT introduces automatic carrier tape welding and fine gap technology |
| J-STD-001 | Technical requirements for welding of electrical and electronic components |
| K-IPC-HDBK-001 | Technical Manual and Guidelines for Soldering Electrical and Electronic Components Requirements |
| J-STD-002 | Solderability Testing of Component Leads, Solder Terminals, Terminals, Binding Posts and Wires |
| J-STD-003 | Printed circuit board solderability test |
| J-STD-004 | Flux Technical Requirements |
| J-STD-005 | Solder Paste Technical Requirements |
| J-STD-006 | Technical Requirements for Fluxed and Unfluxed Solid Solders Used in Electronic Solder Alloys and Electronic Soldering Applications |
| J-STD-012 | Implementation Procedures for Flip-Chip and Chip-Scale Technologies |
| J-STD-013 | Implementation Procedures for Ball Grid Arrays and Other High Density Technologies |
| IPC-DRM-18 | Component Qualification Reference Manual |
| J-STD-020 | Humidity/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
| IPC-DRM-40 | Through Hole Solder Joint Evaluation Reference Manual |
| IPC-TRM-SMT | Surface Mount Solder Joint Evaluation Reference Manual |
| IPC-T-50 | Electronic circuit interconnection and packaging terms and definitions |
| IPC-SC-60 | Post-Weld Solvent Cleaning Manual |
| IPC-SA-61 | Post-Weld Semi-Aqueous Cleaning Manual |
| IPC-AC-62 | Post-Weld Water Cleaning Manual |
| IPC-CH-65 | Printed Circuit Board and Component Cleaning Guidelines |
| IPC-CS-70 | Safety Guidelines for Handling Compounds in Printed Circuit Board Manufacturing |
| IPC-CM-78 | Surface Mount and Interconnect Chip Carrier Guidelines |
| IPC-MP-83 | IPC Metric Method |
| IPC-PC-90 | General Technical Specification for the Implementation of Statistical Process Control |
| IPC-Q-95 | General technical specifications for implementing ISO 9000 quality systems |
| IPC-L-108 | Technical Specification for Thin Layer Metal Cladding Substrate Materials for Multilayer Printed Boards |
| IPC-L-109 | Technical Specification for Fiber Impregnated Epoxy Resins for Multilayer Printed Boards |
| IPC-CC-110 | Guidelines for Selection of Core Structures for Multilayer Printed Wiring Boards |
| IPC-L-112 | Technical Specification for Cladding Composite Metal Substrate Materials for Printed Boards |
| IPC-L-115 | Technical Specification for Rigid Metal Cladding Substrate Materials for Printed Boards |
| IPC-L-125 | Specification for Covered or Uncovered Plastic Substrates for High Speed/High Frequency Interconnects |
| IPC-L-130 | Is mainly used for thin laminates and metal-clad technical specifications for general multilayer printed boards. |
| IPC-EG-140 | Technical Specification for Fiber Textiles Made of “E” Glass for Printed Circuit Boards |
| IPC-SG-141 | Technical Specification for Fiber Textiles Made of “S” Glass for Printed Circuit Boards |
| IPC-A-142 | Technical Specification for Fiber Textiles Made of Aramid Glass for Printed Circuit Boards |
| IPC-QF-143 | General Technical Specification for Fiber Textiles Made of Quartz for Printed Circuit Boards |
| IPC-CF-148 | Epoxy-coated metal for printed circuit boards |
| IPC-MF-150 | Metal foil for printed wiring |
| IPC-CF-152 | Technical Specification for Composite Metal Materials for Printed Circuit Boards |
| IPC-FC-203 | Technical specifications for flat cables, round conductors, and ground planes |
| IPC-FC-210 | Flat Connector Underground Cable Performance Technical Specification |
| IPC-FC-213 | Technical Specification for Flat Underground Telephone Cables |
| IPC-FC-218 | General Technical Specification for Connectors and Electrical Flat Cable Types |
| IPC-FC-219 | Flat cable connector for aerospace sealed environment |
| IPC-FC-220 | Technical specifications for unshielded flat cables and flat connectors |
| IPC-FC-221 | Technical Specification for Flat Copper Conductors for Flat Cables |
| IPC-FC-222 | Technical specification for round conductors of unshielded flat cables |
| IPC-FC-225 | Flat Cable Design Guide |
| IPC-FC-231 | Flexible Base Insulating Materials for Flexible Printed Circuits |
| IPC-FC-232 | Coating adhesive for flexible printed circuits and flexible connection film covering boards |
| IPC-FC-233 | Reference |
| IPC-FC-241 | Flexible metal-clad insulating materials for use in the manufacture of flexible printed circuits |
| IPC-RF-245 | Rigid-Flexible Printed Circuit Board Performance Specification |
| IPC-D-249 | Single and double-sided flexible printed circuit board design standard |
| IPC-FC-250A | Technical specification for single- and double-sided flexible printed circuits |
| IPC-FA-251 | Guidelines for Single- and Double-Sided Flexible Circuits |
| IPC-D-275 | Design Standard for Rigid Printed Circuit Boards and Rigid Printed Circuit Board Assemblies |
| IPC-RB-276 | Rigid Printed Circuit Board Specification and Performance Specification |
| IPC-D-279 | Design Guide for Reliable Surface Mount Technology Printed Circuit Board Assemblies |
| IPC-D-300 | Printed Circuit Board Dimensions and Tolerances |
| IPC-D-310 | Technical Guide for Photographic Tool Generation and Measurement |
| IPC-A-311 | Guide to Process Control for the Generation and Use of Photographic Tools |
| IPC-D-316 | Microwave Circuit Board Design Guidelines Using Soft Substrates |
| IPC-D-317 | Design Guide for Electronic Packages Using High-Speed Technology |
| IPC-HF-318 | Inspection and Testing of Microwave End Product Circuit Boards |
| IPC-D-319 | Design Standard for Rigid Single- and Double-Sided Printed Circuit Boards |
| IPC-D -320A | Printed Circuit Boards, Rigid, Single and Double Sided, End Product Standard |
| IPC-SD-320B | Performance Specification for Rigid Single- and Double-Sided Printed Circuit Boards |
| IPC-D-322 | Guidelines for Selecting Printed Circuit Board Dimensions Reference to Standard Board Dimensions |
| IPC-MC-324 | Metal Core Circuit Board Performance Specification |
| IPC-D-325 | Technical Requirements for Printed Circuit Boards, Components, and Supporting Drawings |
| IPC-D-326 | Technical Requirements for Manufacturing Printed Circuit Board Assemblies |
| IPC-D-330 | Design Guidelines Manual |
| IPC-PD-335 | Electronic Packaging Manual |
| IPC-NC-349 | Router Computer Numerical Control Formatting |
| IPC-D-350 | Numerical Description of Printed Circuit Boards |
| IPC-D-351 | Numerical Description of Printed Circuit Board Diagrams |
| IPC-D-352 | Electronic design data description for printed circuit boards using digital pairs |
| IPC-D-354 | Digital Format Printed Circuit Board Library Format Description |
| IPC-D-355 | Numerical description of printed circuit board assembly |
| IPC-D-356 | Electrical Performance Data for Bare Boards Tested in Digital Form |
| IPC-MB-380 | Molded Interconnect Device Guide |
| IPC-D-390 | Automation Design Guide |
| IPC-C-406 | Surface Mount Connector Design and Application Guide |
| IPC-CI-408 | Design and Application Guide for Non-Solderable Surface Mount Connectors |
| IPC-BP-421 | General Technical Specification for Press-Fit Rigid Printed Circuit Board Backplanes |
| IPC-D-422 | Design Guide for Press-Fit Rigid Printed Circuit Board Backplanes |
| IPC-DW-424 | General Specification for Sealed Discrete Wire Interconnect Circuit Boards |
| IPC-DW-425 | Discrete circuit board design and terminal product technical requirements |
| IPC-DW-426 | Discrete Circuit Assembly Technical Specification |
| IPC-TR-460 | Printed circuit board wave soldering fault detection table |
| IPC-TR-461 | Solderability Evaluation of Thick and Thick Coatings |
| IPC-TR-462 | Solderability evaluation of printed wiring boards coated with protective coatings for long-term storage |
| IPC-TR-464 | Accelerated Aging for Solderability Evaluation |
| IPC-TR-465-1 | Cyclic Testing of Stability of Vapor Aging Temperature Control |
| IPC-TR-465-2 | Effect of Vapor Aging Time and Temperature on Solderability Test Results |
| IPC-TR-465-3 | Regarding Steam Aging Evaluation of Alternative Finishes |
| IPC-TR-466 | Wetting Balance Standard Weight Comparison Test |
| IPC-TR-467 | ANSI/J-STD-001 |
| IPC-TR-468 | Factors Affecting Printed Circuit Board Insulation Resistance Performance |
| IPC-TR-470 | Thermal Characteristics of Multilayer Interconnect Circuit Boards |
| IPC-TR-474 | Discrete Line Technology Overview |
| IPC-TR-476 | How to avoid metal expansion problems in electronic hardware |
| IPC-TR-480 | Multilayer IV Cycle Test Procedure Phase I Results |
| IPC-TR-481 | Multilayer V-Cycle Test Procedure Results |
| IPC-TR-483 | Dimensional Stability Test Bowl for Thin Laminates |
| IPC-TR-484 | Results of IPC Copper Foil Ductility Cyclic Study |
| IPC-TR-485 | IPC copper foil brittle strength test cycle study results |
| IPC-TR-549 | Spots on Printed Circuit Boards |
| IPC-TR-551 | Quality Evaluation of Printed Board Electronic Component Assembly and Interconnection |
| IPC-DR-570 | General Specification for Printed Boards with Carbide Drills, 1/8 Inch Diameter |
| IPC-DR-572 | Printed Circuit Board Drilling Guide |
| IPC-TR-576 | Process Evaluation |
| IPC-TR-578 | Lead Edge Manufacturing Technical Report |
| IPC-TR-579 | Cyclic Reliability Evaluation of Small Diameter Plated Through Holes in Printed Circuit Boards |
| IPC-TR-580 | Washing and Cleanliness Test Procedure Phase 1 Test Results |
| IPC-TR-581 | IPC Phase 3 Controlled Atmosphere Welding Study |
| IPC-TR-582 | IPC Phase 3 No-Clean Flux Study |
| IPC-A-600 | Acceptability of Printed Circuit Boards (Inspection Standard) |
| IPC-QE-605A | Printed Circuit Board Quality Evaluation Manual |
| IPC-SS-605 | Printed circuit board quality evaluation |
| IPC-A-610 | Inspection Standard for Electronic Components |
| IPC-QE-615 | Assembly Quality Assessment Manual |
| IPC-SS-615 | Assembly Quality Assessment |
| IPC-AI-640 | User Guide for Automatic Inspection of Thick Film Mixed Substrates without Mounted Components |
| IPC-AI-641 | Automatic Solder Joint Inspection User Guide |
| IPC-AI-642 | User Guide for PWB Automatic Inspection of Schematics, Inner Layers, and Unmounted Components |
| IPC-OI-645 | Optical Inspection Instrument Standard |
| IPC-TM-650 | Test Method Manual |
| IPC-ET-652 | Electrical test rules and technical requirements for printed circuit boards without mounted components |
| IPC-QL-653 | Equipment Qualification for Inspection/Test Printed Circuit Boards, Components, and Materials |
| IPC-MI-660 | Raw Material Incoming Inspection Manual |
| IPC-R-700C | Guide for Modification, Rework, and Repair of Printed Circuit Boards and Assemblies |
| IPC-TA-720 | Laminate Technical Assessment Manual |
| IPC-TA-721 | Multilayer Circuit Board Technology Evaluation Manual |
| IPC-TA-722 | Welding Technology Assessment |
| IPC-TA-723 | Surface Assembly Technology Evaluation Manual |
| IPC-TA-724 | Clean Room Technology Assessment |
| IPC-PE-740 | Guide to Fault Detection in Printed Circuit Board Manufacturing and Assembly |
| IPC-CM-770 | Printed circuit board component placement |
| IPC-SM-780 | Packaging and Interconnection of Surface Mount Components |
| IPC-SM-782 | Surface Mount Design and Land Pattern Standard |
| IPC-EM-782 | Surface Mount Design and Land Pattern |
| IPC-SM-784 | COB Technical Application Guide |
| IPC-SM-785 | Guide for Rapid Reliability Testing of Surface Mount Solder Joints |
| IPC-SM-786 | Characterization and Processing Procedures for Moisture Atmosphere/Reflow Sensing ICs |
| IPC-MC-790 | Multi-chip Module Technology Application Guide |
| IPC-S-804 | Solderability Test Method for Printed Circuit Boards |
| IPC-S-805 | Solderability Testing of Component Leads and Terminations |
| IPC-MS-810 | High Volume Microsection Guide |
| IPC-S-815 | General Technical Requirements for Soldered Electronic Interconnects |
| IPC-S-816 | SMT Process Guide and Checklist |
| IPC-SM-817 | General technical requirements for insulating surface mount adhesives |
| IPC-SF-818 | General technical requirements for fluxes used in soldering electronic components |
| IPC-SP-819 | General technical requirements and test methods for solder pastes used in the electronics industry |
| IPC-AJ-820 | Assembly and Connection Manual |
| IPC-CA-821 | General technical requirements for thermally conductive adhesives |
| IPC-CC-830 | Qualification and Performance of Electronic Insulating Compounds for Use in Printed Circuit Board Assemblies |
| IPC-SM-839 | Cleaning Guidelines Before and After Application of Solder Mask |
| IPC-SM-840 | Qualification and Performance of Permanent Polymer Coatings for Printed Circuit Boards |
| IPC-H-855 | Hybrid Microcircuit Design Guide |
| IPC-D-859 | Thick Film Multilayer Hybrid Circuit Design Standard |
| IPC-HM-860 | Multilayer Hybrid Circuit Technical Specification |
| IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Circuit Boards |
| IPC-D-949 | Rigid Multilayer Printed Circuit Board Design Standard |
| IPC-ML:-950 | Performance Specification for Rigid Multilayer Printed Circuit Boards |
| IPC-ML-960 | Technical Specification for Qualification and Performance of Bulk Laminated Panels for Multilayer Printed Circuit Boards |
| IPC-ML-975 | End Product Specification for Multilayer Printed Wiring Boards |
| IPC-ML-990 | Flexible Multilayer Circuit Performance Specification |
| IPC-1402 | Hybrid Microcircuit Design Guide |
| IPC-1710 | OEM Standard for Printed Circuit Board Manufacturer’s Qualification Profile (MQP) |
| IPC-1720 | Assembly Qualification Profile (AQP) |
| IPC-1730 | Gluer Qualification Curve (LQP) |
| IPC-2141 | Controlled Impedance Circuit Boards and High-Speed Logic Design |
| IPC-2221 | Generic Standard for Printed Circuit Boards |
| IPC-2222 | Rigid Organic Printed Circuit Board Section Design Standard |
| IPC-2223 | Flexible Printed Circuit Board Segmentation Design Standard |
| IPC-3406 | Conductive Adhesive Rules for Surface Assembly |
| IPC-3408 | General technical requirements for anisotropic conductive adhesive films |
| IPC-4101 | Technical Specification for Substrate Materials for Rigid and Multilayer Printed Boards |
| IPC-4110 | Technical Specification and Characterization Methods for Nonwoven Cellulosic Papers for Printed Circuit Boards |
| IPC-4130 | Technical Specification and Characterization Method for Nonwoven “E” Fiberglass Panels |
| IPC-6011 | General Performance Technical Specification for Printed Circuit Boards |
| IPC-6012 | Qualification and Performance Specification for Rigid Printed Circuit Boards |
| IPC-6013 | Qualification and Performance Specification for Flexible Printed Circuit Boards |
| IPC-6015 | Technical Specification for Qualification and Performance of Organic Multichip Modules (MCM-L) Assembly and Interconnect Structures |
| IPC-6018 | Microwave terminal product circuit board inspection and testing |
| IPC/JPCA-6202 | Single- and Double-sided Flexible Printed Circuit Board Performance Guidance Manual |
| IPC-7711 | Electronic component return for repair |
| IPC-7721 | Rework and Modification of Printed Circuit Boards and Electronic Assemblies |
| IPC-9201 | Surface Insulation Resistance Manual |
| IPC-9501 | Evaluation of PWB Simulation Assembly Process for Electronic Components |
| IPC-9504 | Evaluation of Simulated Assembly Processes for Non-IC Components |
Since 1996, POE has become a globally renowned PCB company, providing small to medium volume PCB/ PCBA manufacturing services.
