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Telecommunications 16 Layer
16 Layer PCB
Material:FR-4 TG170 Thickness: 2.4mm Surface processing:Immersion Gold Solder mask: LPI Green Drill hole(Min.):0.1mm buried and blind hole Min. line space: 0.08mm Min. line width: 0.08mm Copper thickness: 2OZ finished, 1oz inner ![]() |