Telecommunications 16 Layer

16 Layer PCB
Material:FR-4 TG170 
Thickness: 2.4mm 
Surface processing:Immersion Gold
Solder mask: LPI Green
Drill hole(Min.):0.1mm buried and blind hole
Min. line space: 0.08mm 
Min. line width: 0.08mm
Copper thickness: 2OZ finished, 1oz inner